
Manufacturer Part #
SST39VF020-70-4C-WHE
SST39VF Series 2 Mbit 256K x 8 3 V Multi-Purpose Flash - TSOP-32
Microchip SST39VF020-70-4C-WHE - Product Specification
Shipping Information:
ECCN:
PCN Information:
EOL Description:The selected SST39VF040, SST39VF020, SST39LF040, SST39VF010, SST39LF010 andSST39LF020 device families will be moving to End of Life (EOL) status effective today. These selecteddevice families will no longer be offered after December 31, 2024. Please review the attached partsaffected list below for details about replacement parts if applicable.Reason for EOL:No longer have manufacturing support for the CPN listed in the attachment.****Last date for bookings (LTB): September 15, 2024****Last date for shipments (LTS): December 31, 2024
Revision History:February 11, 2022: Issued initial notification.April 20, 2022: Re-issued initial notification. Updated Qualification Plan. Added BQM, Pin 1 Orientation, tray and reel color and packing method in the Pre and Post Change summary.July 12, 2022: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on August 13, 2022.Description of Change:Qualification of MTAI as a new final test location for selected SST39LF0xx, SST39LF2xx and SST39VF0xx device families available in various packages.Reason for Change:To improve manufacturability by qualifying MTAI as a new final test location.
PCN Status:Initial NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of MTAI as a new final test location for selected SST39LF0xx, SST39LF2xx and SST39VF0xx device families available in various packages.Impacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying MTAI as a new final test location.Change Implementation Status:In ProgressEstimated Qualification Completion Date:May 2022
PCN Status:Initial NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of MTAI as a new final test location for selected SST39LF0xx, SST39LF2xx and SST39VF0xx device families available in various packages.Impacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying MTAI as a new final test location.Change Implementation Status:In ProgressEstimated Qualification Completion Date:March 2022
Part Status:
Microchip SST39VF020-70-4C-WHE - Technical Attributes
Memory Density: | 2Mb |
Memory Organization: | 256 K x 8 |
Supply Voltage-Nom: | 2.7V to 3.6V |
Access Time-Max: | 70ns |
Package Style: | TSOP-32 |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
208 per Tray
Package Style:
TSOP-32
Mounting Method:
Surface Mount