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Manufacturer Part #
MCP6043T-E/CH
MCP6043 Series 6 V 14 kHz Rail-to-Rail I/O Operational Amplifier -SOT-23-6
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Reel Package Style:SOT-23-6 (SOT-26) Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP6043T-E/CH - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for MCP603T-E/CH, MCP603T-I/CH, MCP6043T-E/CH, MCP6043T-I/CH, MCP6143T-E/CH, MCP6273T-E/CH, MCP6283T-E/CH and MCP6293T-E/CH catalog part numbers (CPN) available in 6L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for MCP603T-E/CH, MCP603T-I/CH, MCP6043T-E/CH, MCP6043T-I/CH, MCP6143T-E/CH, MCP6273T-E/CH, MCP6283T-E/CH and MCP6293T-E/CH catalog part numbers (CPN) available in 6L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP11xxx, MCP60xxx, MCP61xxx, MCP62xxx, MCP64xxx, MCP65xxx, MCP6Gxxx, MCP6Lxxx, and TC127xxx device families available in 6L and 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
PCN Status:Initial NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP11xxx, MCP60xxx, MCP61xxx, MCP62xxx, MCP64xxx, MCP65xxx, MCP6Gxxx, MCP6Lxxx, and TC127xxx device families available in 6L and 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP6043T-E/CH&field4=Microchip&field18=https://p1na.futureelectronics.com/p/analog--amplifiers--general-purpose/mcp6043t-e-ch-microchip-3564002
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP6043T-E/CH&field4=Microchip&field18=https://p1na.futureelectronics.com/p/analog--amplifiers--general-purpose/mcp6043t-e-ch-microchip-3564002
Microchip MCP6043T-E/CH - Technical Attributes
| No of Channels: | 1 |
| Slew Rate-Nom: | 3V/ms |
| Input Offset Voltage-Max: | 3mV |
| Package Style: | SOT-23-6 (SOT-26) |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23-6 (SOT-26)
Mounting Method:
Surface Mount