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Manufacturer Part #
DSC8121CI2
DSC8121: Programmable Low-Power Precision CMOS Oscillator, -40°C to 85°C, ±25ppm
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:110 per Tube | ||||||||||
| Date Code: | |||||||||||
Microchip DSC8121CI2 - Product Specification
Shipping Information:
ECCN:
PCN Information:
Pre Change: With top mark DCPYYWW at the 2nd line marking. Post Change:With top mark DCPYYWW or DAPYYW at the 2nd line marking.Reason for Change: To improve manufacturability and traceability by implementing top marking changes for DSCxxx and DSAxxx products available in 6L VDFN, 4L VDFN, 4L VFLGA, 6L VFLGA, 4L VLGA, 14L VQFN and 20L VQFN packages.Change Implementation Status:In ProgressEstimated First Ship Date: November 19, 2020 (date code: 2047)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Revision History:December 02, 2019: Issued initial notification.January 08, 2019: Re-issued initial notification to add CCB 3589.001. Updated the affected CPN list and Qualification plan.January 09, 2020: Re-issued initial notification to correct typographical error in revision history.February 28, 2020: Issued final notification. Attached the qualification report. Provided estimated first ship date to be March 28, 2020.Description of Change:Qualification of new bill of materials (BOM) in selected Micrel products available in 6L VDFN (3.2x2.5x0.9mm and 2.0x2.5mm) package at NSEB assembly site.Pre Change:Using NEX-130CT & 8200T die attach, G770HCD molding compound and Q3-6646 die coat material.Post Change:Using HR-5104 & 2200D die attach, G700LTD molding compound and JCR6109 die coat material.Reason for Change:To improve manufacturability and productivity by qualify new bill of materials (BOM).Change Implementation Status:In ProgressEstimated First Ship Date:March 28, 2020 (date code: 2013)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Notification subject: CCB 3433 Final Notice: Qualification of a new fabrication site (Microchip -Fab 5) for selected DSCxxx and DSAxxx product available in 6L VDFN, 4L VDFN, 4L VFLGA, 6L VFLGA, 4L VLGA, 14L VQFN and 20L VQFN packages.PCN Status: Final notification.PCN Type: Manufacturing ChangeDescription of Change: Qualification of a new fabrication site (Microchip -Fab 5) for selected DSCxxx and DSAxxx product available in 6L VDFN, 4L VDFN, 4L VFLGA, 6L VFLGA, 4L VLGA, 14L VQFN and 20L VQFN packages.Pre Change: Die # 2 Fabricated at Silex Microsystems sitePost Change: Die # 2 Fabricated at Microchip Technology Colorado - Fab 5 site.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Colorado - Fab 5 site.Change Implementation Status: In ProgressEstimated First Ship Date: April 17, 2020 (date code: 2016)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Revision History:February 24, 2020: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on April 17, 2020.February 26, 2020: Re-issued final notification. Updated the plant code for die #1 at Taiwan Semiconductor Manufacturing Corp. - Fab 3 from TSMC to TC03 and updated the quality certification for die # 1 at Taiwan Semiconductor Manufacturing Corp. Fab-3.Description of Change:Qualification of a new fabrication site (Microchip -Fab 5) for selected DSCxxx and DSAxxx product available in 6L VDFN, 4L VDFN, 4L VFLGA, 6L VFLGA, 4L VLGA, 14L VQFN and 20L VQFN packages.Pre Change:Die # 2 Fabricated at Silex Microsystems site.Post Change:Die # 2 Fabricated at Microchip Technology Colorado - Fab 5 site.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Colorado - Fab 5 site.Estimated First Ship Date:April 17, 2020 (date code: 2016)
CCB 3859 and 3859.001 Initial Notice: Qualification of new bill of materials (BOM) in selected Micrel products available in 6L VDFN (3.2x2.5x0.9mm) package at NSEB assembly site.PCN Status: Initial notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of new bill of materials (BOM) in selected Micrel products available in 6L VDFN (3.2x2.5x0.9mm) package at NSEB assembly site.Pre Change: Using NEX-130CT & 8200T die attach, G770HCD molding compound and Q3-6646 die coat materialPost Change: Using HR-5104 & 2200D die attach, G700LTD molding compound and JCR6109 die coat materialImpacts to Data Sheet: NoneChange Impact: NoneReason for Change: To improve manufacturability and productivity by qualify new bill of materials (BOM).Change Implementation Status: In Progress
Revision History:December 02, 2019: Issued initial notification.January 08, 2019: Re-issued initial notification to add CCB 3589.001. Updated the affected CPN list and Qualification plan.January 09, 2020: Re-issued initial notification to correct typographical error in revision historyDescription of Change:Qualification of new bill of materials (BOM) in selected Micrel products available in 6L VDFN (3.2x2.5x0.9mm) package at NSEB assembly site.Pre Change:Using NEX-130CT & 8200T die attach, G770HCD molding compound and Q3-6646 die coat material.Post Change:Using HR-5104 & 2200D die attach, G700LTD molding compound and JCR6109 die coat material.Reason for Change:To improve manufacturability and productivity by qualify new bill of materials (BOM)
Initial Notice: Qualification of new bill of materials (BOM) in selected Micrel products available in 6L VDFN (3.2x2.5x0.9mm) package at NSEB assembly site. Pre Change: Using NEX-130CT & 8200T die attach, G770HCD molding compound and Q3-6646 die coat materialPost Change: Using HR-5104 & 2200D die attach, G700LTD molding compound and JCR6109 die coat materialReason for Change: To improve manufacturability and productivity by qualify new bill of materials (BOM).
Part Status:
Available Packaging
Package Qty:
110 per Tube