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Amphenol Communications Solutions | DILB18P-223TLF

Manufacturer Part #

DILB18P-223TLF

18 POS TIN LEAD DIP SOCKET

ECAD Model:
Mfr. Name: Amphenol Communications Solutions
Standard Pkg:
Product Variant Information section
Date Code: 2528
Product Specification Section
Amphenol Communications Solutions DILB18P-223TLF - Technical Attributes
Attributes Table
Type: DIP Socket
Style: PCB Through Hole
No of Pins: 18
Termination Style/Mounting: Solder
Terminal Pitch: 2.54mm
Contact Material: Copper Alloy
Contact Plating: Matte-Tin
Rated Current: 1A
Rated Voltage: 200V
Material: Polyamide
Insulation Resistance: 1GΩ
Operating Temp Range: -55°C to +105°C
No of Rows: 2
Dielectric Withstanding Voltage: 1000V
Mounting Method: Through Hole
Pricing Section
Global Stock:
15,496
USA:
15,496
On Order:
0
Factory Stock:Factory Stock:
0
Factory Lead Time:
9 Weeks
Minimum Order:
1
Multiple Of:
1
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Tariff charges may apply if shipping to the United States. An estimate of tariff charges will be calculated at checkout.
Total
$0.33
USD
Quantity
Unit Price
1
$0.325
100
$0.315
300
$0.31
1,000
$0.30
3,000+
$0.29
Product Variant Information section