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Référence fabricant
84952-4
4 Positon 1 mm Pitch Horizontal SMT FPC Connector Receptacle
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| Nom du fabricant: | TE Connectivity | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1500 par | ||||||||||
| Code de date: | 1819 | ||||||||||
TE Connectivity 84952-4 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=84952-4&field4=TE Connectivity&field18=https://p1na.futureelectronics.com/fr/p/interconnect--ffc-fpc--ffc-fpc-connectors/84952-4-te-connectivity-6018125
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=84952-4&field4=TE Connectivity&field18=https://p1na.futureelectronics.com/fr/p/interconnect--ffc-fpc--ffc-fpc-connectors/84952-4-te-connectivity-6018125
TE Connectivity 84952-4 - Caractéristiques techniques
| Flat Flex Type: | FFC, FPC |
| No of Positions: | 4 |
| Pitch: | 1 mm |
| Style/Orientation: | Receptacle |
| Termination: | Solder |
| Current Rating: | 1A |
| Contact Plating: | Tin |
| Material: | LCP |
| Contact Material: | Phosphor Bronze |
| Operating Temp Range: | -40°C to +85°C |
Fonctionnalités et applications
The 84952-4 is a part of Wire to Board connectors with low profile and light-weight features having reduced size, weight and assembly cost.
This is widely used in computer industry, particularly in such applications as Lap Top, Notebook, Palm Top and Note Pad Computers. Other markets include: Disk Drives, Printers, Plotters, Copiers, Cellular Phones, and Medical Equipment. Operating temprature ranges from -40°C – +85°C
Product Features:
- 4 Positions
- Matte Tin Contact Plating, Mating Area, Material
- Contact Plating, Mating Area, Thickness = 2 µm
- Liquid Crystal Polymer (LCP) Housing Material
- Contact Current Rating, Max (A) = 1
- Operating Voltage (VAC) = 200
- Selectively Loaded = No
- PCB Mount Retention Type = Solder Pads
- Profile Height (Y-Axis) = 2.56 mm
- Contact Plating, Mating Area, Material = Matte Tin
- Housing Material = Liquid Crystal Polymer (LCP)
- Contact Mating Location = Bottom
- Lead Free Solder Processes = Reflow solder capable to 245°C, Reflow solder capable to 260°C
- Contact Design = Single Beam
Emballages disponibles
Qté d'emballage(s) :
1500 par