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Manufacturer Part #
SST25VF080B-50-4C-QAF
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98 per Tube
WSON-8
Surface Mount
Shipping Information:
HTS Code:
ECCN:
PCN Information:
***UPDATE OF PCN118021***Revision History: December 11, 2025: Issued initial notification.April 23, 2026: Issued final notification. Provided estimated first ship date to be on May 11, 2026.Description of Change: Qualification of MMT as an additional assembly site for selected SST26WF016B, SST26WF016BA, SST26WF080B, SST26WF080BA, SST26WF040B, SST26WF040BA, SST26VF032B, SST26VF032BA, SST26WF064C, SST26VF064BEUI, SST26VF016B, SST26VF080A, SST26VF040A, SST26VF020A, SST25VF080B, SST25VF020B, SST25VF040B, SST26VF064B, SST26VF064BA and SST25PF020B device families available in 8LWSON (6x5x0.8mm) packageReason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site.Estimated Qualification Completion Date: 05 July 2026Estimated First Ship Date: 11 May 2026 (date code: 2620)
Description of Change: Qualification of MMT as an additional assembly site for selected SST26WF016B, SST26WF016BA, SST26WF080B, SST26WF080BA, SST26WF040B, SST26WF040BA, SST26VF032B, SST26VF032BA, SST26WF064C, SST26VF064BEUI, SST26VF016B, SST26VF080A, SST26VF040A, SST26VF020A, SST25VF080B, SST25VF020B, SST25VF040B, SST26VF064B, SST26VF064BA and SST25PF020B device families available in 8L WSON (6x5x0.8mm) package.Reason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: January 2026
PCN Status:Final NotificationDescription of Change:Qualification of NSEB and UTL3 as additional assembly sites for selected SST25PF0xx, SST2xVF0xx, USBF1600x and USBF8100x device families available in 8L TDFN-S (6x5x0.8mm) package.Reason for Change:To improve on-time delivery performance by qualifying UTL3 and NSEB as an additional assembly sites.Change Implementation Status:In ProgressEstimated First Ship Date:May 31, 2024 (date code: 2422)
PCN Status:Final NotificationDescription of Change:Qualification of NSEB and UTL3 as additional assembly sites for the selected SST25VF016B, SST25VF040B, SST25VF080B, SST25WF020A and SST26VF016 device families available in 8L TDFN-S (6x5x0.8mm) package.mpacts to Data Sheet:Yes.Note: Microchip will issue separate PCN for datasheet update.Reason for Change:To improve on-time delivery performance by qualifying UTL3 and NSEB as an additional assembly sites.Change Implementation Status:In ProgressEstimated First Ship Date:May 31, 2024 (date code: 2422)
Description of Change:Qualification of NSEB and UTL3 as additional assembly sites for the selected SST26VF016, SST25VF016B, SST25VF0x0B and SST25WF020Ax device families available in 8L TDFN-S (6x5x0.8mm) package.Pre and Post Change Summary: See attachedImpacts to Data Sheet:Yes.Note: Microchip will issue separate PCN for datasheet update.Change ImpactNoneReason for Change:To improve on-time delivery performance by qualifying UTL3 and NSEB as an additional assembly sites.Change Implementation Status:In ProgressEstimated Qualification Completion Date:January 2024Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Time Table Summary: See attached
Description of Change: Qualification of NSEB and UTL3 as additional assembly sites for selected SST25PF0xx, SST2xVF0xx, USBF1600x and USBF8100x device families available in 8L TDFN-S (6x5x0.8mm) package.Reason for Change: To improve on-time delivery performance by qualifying UTL3 and NSEB as an additional assembly sites.
Description of Change: Corrected a typo on page 8.Reason for Change: To Improve ManufacturabilityNOTE: Please be advised that this is a change to the document only the product has not been changed.
Part Status:
NOTE: This SST product is migrating to the preferred Microchip (MCP) part number. All products bearing the Microchip part number are identical in form, fit and function to the products with the legacy SST prefix/logo mark.
The SSST25VF080B-50-4C-QAF is a part of SST25VF series SPI Serial Flash. It has an standard industria operating temperature ranging from -40°C to +85°C, it comes in WSON-8 package.
The SST25VF080B devices are enhanced with improved operating frequency for lower power consumption. SST25VF080B SPI serial flash memories are manufactured with SST's proprietary, high-performance CMOS SuperFlash technology. The split-gate cell design and thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches.
Features:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.