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Référence fabricant
AT27C512R-70PU
AT27C512R Series 5.5 V 512 Kb (64 K x 8) 70 ns Through Hole EPROM OTP - PDIP-28
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :14 par Tube Style d'emballage :PDIP-28 Méthode de montage :Through Hole | ||||||||||
| Code de date: | 1451 | ||||||||||
Microchip AT27C512R-70PU - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: Qualification of ASEK as new assembly site for selected A40MX02, A40MX04, A42MX09 and A42MX16 device families available in 100L PQFP (14x20x2.7mm) package.Reason for Change: To improve manufacturability by qualifying ASEK as a new assembly site.Estimated Qualification Completion Date: August 2025
Description of Change: Qualification of MMT as a new final test site for selected AT27C512R-70PU, AT28C256-15PU, AT28C64B-15PU, AT27C256R-45PU, AT27C256R-70PU and AT27C512R-45PU catalog part numbers (CPN) available in 28L PDIP (.600in) package.Reason for Change: To improve manufacturability by qualifying MMT as a new final test site.Estimated First Ship Date: 01 May 2025 (date code: 2518)
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=AT27C512R-70PU&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/memory--ram--eprom/at27c512r-70pu-microchip-8038278
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=AT27C512R-70PU&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/memory--ram--eprom/at27c512r-70pu-microchip-8038278
Microchip AT27C512R-70PU - Caractéristiques techniques
| Memory Density: | 512kb |
| Memory Organization: | 64 K x 8 |
| Supply Voltage-Nom: | 4.5V to 5.5V |
| Access Time-Max: | 70ns |
| Temperature Grade: | Industrial |
| Style d'emballage : | PDIP-28 |
| Méthode de montage : | Through Hole |
Emballages disponibles
Qté d'emballage(s) :
14 par Tube
Style d'emballage :
PDIP-28
Méthode de montage :
Through Hole