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Manufacturer Part #
MCP6021T-E/OT
MCP6021 Series 5.5 V 10 MHz Rail-to-Rail I/O Operational Amplifier- SOT-23-5
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Reel Package Style:SOT-23-5 (SOT-25) Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2335 | ||||||||||
Microchip MCP6021T-E/OT - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
*** Update for PCN 115274 ***Revision History: August 15, 2025: Issued initial notification. October 28, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be November 17, 2025. Added a new column titled 'Change (Yes/No)' to the Pre and Post Change Summary table.Description of Change: Qualification of CRM-1151GA as a new die attach material for selected MCP1316, MCP1316M, MCP1317, MCP1318, MCP1318M, MCP1319, MCP1319M, MCP132x, MCP1824, MCP3021, MCP3221, MCP6001, MCP60x, MCP6021, MCP6231U, MCP6241U, MCP6271, MCP628x, MCP6291, MCP6401, MCP6401U, MCP6406, MCP6441, MCP654xU, MCP656x, MCP6G01, MCP6G01U, MCP6L01U, MCP6L1, MCP6L71, TC101x, TC105x, TC107x, TC118x, TC122x, TC201x, TC205x, TC218x and TC74 device families available in 5L & 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated First Ship Date: 17 November 2025 (date code: 2547)
***UPDATE OF PCN113920***Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material for selected MCP18x, MCP60x, MCP61x, MCP6Lx, MCP13x, MCP32x, MCP30x, TC74, MCP65x, MCP64x, MCP62x, MCP6Gx, TC118x, TC101x, TC107x, TC105x, TC122x, TC201x, TC218x, and TC205x device families available in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 19 August 2025 (date code: 2534)
Description of Change: Qualification of CRM-1151GA as a new die attach material for selected MCP1316, MCP1316M, MCP1317, MCP1318, MCP1318M, MCP1319, MCP1319M, MCP132x, MCP1824, MCP3021, MCP3221, MCP6001, MCP60x, MCP6021, MCP6231U, MCP6241U, MCP6271, MCP628x, MCP6291, MCP6401, MCP6401U, MCP6406, MCP6441, MCP654xU, MCP656x, MCP6G01, MCP6G01U, MCP6L01U, MCP6L1, MCP6L71, TC101x, TC105x, TC107x, TC118x, TC122x, TC201x, TC205x, TC218x and TC74 device families available in 5L & 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material. Estimated Qualification Completion Date: September 2025
Description of Change: Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material for selected MCP18x, MCP60x, MCP61x, MCP6Lx, MCP13x, MCP32x, MCP30x, TC74, MCP65x, MCP64x, MCP62x, MCP6Gx, TC118x, TC101x, TC107x, TC105x, TC122x, TC201x, TC218x, and TC205x device families available in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP13xx, MCP1824, MCP3021Axx, MCP3221Axx, MCP6xx, TC10xx,TC118xx, TC122xx, TC20xx, TC218xx and TC74Axx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Microchip has released a new Datasheet for the MCP6021/1R/2/3/4 - Rail-to-Rail Input/Output, 10 MHz Op Amps of devices. Notification Status: FinalDescription of Change: • Added Section “Product Identification System (Automotive)”.• Updated 6.0 “Packaging Information”Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 12 Apr 2023
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP6021T-E/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--analog--amplifiers--general-purpose/mcp6021t-e-ot-microchip-7002803
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP6021T-E/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--analog--amplifiers--general-purpose/mcp6021t-e-ot-microchip-7002803
Microchip MCP6021T-E/OT - Technical Attributes
| Amplifier Type: | General Purpose |
| No of Channels: | 1 |
| Slew Rate-Nom: | 7V/ns |
| Input Offset Voltage-Max: | 500µV |
| Gain Bandwidth Product: | 10MHz |
| Average Bias Current-Max: | 5000pA |
| Supply Voltage: | 2.5V to 5.5V |
| Common Mode Rejection Ratio: | 90dB |
| Supply Current: | 1mA |
| Output Type: | Rail to Rail |
| Power Supply Rejection Ratio: | 90dB |
| Operating Temp Range: | -40°C to +125°C |
| DC Voltage Gain: | 110dB |
| Phase Margin: | 65° |
| Low Noise: | 8.7nV/√Hz |
| Output Current: | 30mA |
| Package Style: | SOT-23-5 (SOT-25) |
| Mounting Method: | Surface Mount |
Features & Applications
The MCP6021T-E/OT is a high performance Rail-to-Rail Input/Output Op-Amp with wideband banwidth(10 MHz), low noise and low distortion, available in SOT-23-5 package.
Features:
- Rail-to-Rail Input/Output
- Wide Bandwidth: 10 MHz (typical)
- Low Noise: 8.7 nV/√Hz, at 10 kHz (typical)
- Low Offset Voltage:
- Industrial Temperature: ±500 μV (maximum)
- Extended Temperature: ±250 μV (maximum)
- Mid-Supply VREF: MCP6021 and MCP6023
- Low Supply Current: 1 mA (typical)
- Total Harmonic Distortion: 0.00053% (typical, G = 1 V/V)
- Unity Gain Stable
- Power Supply Range: 2.5 V to 5.5 V
- Temperature Range:
- Industrial: -40°C to +85°C
- Extended: -40°C to +125°C
Applications:
- Automotive
- Multi-Pole Active Filters
- Audio Processing
- DAC Buffer
- Test Equipment
- Medical Instrumentation
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23-5 (SOT-25)
Mounting Method:
Surface Mount