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Manufacturer Part #
MCP6541T-E/OT
MCP6541 Series 5.5 V 1 pA Push-Pull Output Sub-Microamp Comparator - SOT-23-5
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Reel Package Style:SOT-23-5 (SOT-25) Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP6541T-E/OT - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP11xxx, MCP60xxx, MCP61xxx, MCP62xxx, MCP64xxx, MCP65xxx, MCP6Gxxx, MCP6Lxxx, and TC127xxx device families available in 6L and 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Microchip has released a new Datasheet for the MCP6541/1R/1U/2/3/4 Push-Pull Output Sub-Microamp Comparators Data Sheet of devices.Notification Status: FinalDescription of Change: Revision includes:1. Updated Section 5.1, Package Marking Information.2. Made minor formatting changes throughout the document.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 28 Oct 2022
PCN Status:Initial NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP11xxx, MCP60xxx, MCP61xxx, MCP62xxx, MCP64xxx, MCP65xxx, MCP6Gxxx, MCP6Lxxx, and TC127xxx device families available in 6L and 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Part Status:
Microchip MCP6541T-E/OT - Technical Attributes
| Type: | General Purpose |
| No of Channels: | 1 |
| Average Bias Current-Max: | 1pA |
| Supply Voltage: | 1.6V to 5.5V |
| Thermal Resistance: | 256°C/W |
| Package Style: | SOT-23-5 (SOT-25) |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23-5 (SOT-25)
Mounting Method:
Surface Mount