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Manufacturer Part #
BD18353EFV-ME2
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2500 per Reel
HTSSOP-B20
Surface Mount
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PCN Information:
Title of change:LSI bonding wire material change from gold to copper March 2026Detailed description of changeBefore:Wire Material : Gold (Au)After:Wire Material : Copper (PdCu) For some models, materials other than wire will also be changed. Please refer to the attached document for further details.Reason for changeIn order to ensure stable supply of our products, we intend to submit a PCN to change the bonding wire material from gold to copper.Planned first ship dateOctober 1, 2026
Part Status:
On Order
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.