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MIC4424YM
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95 per Tube
SOIC-8
Surface Mount
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Update of FPCN 120948 - Multiple Change Notification **Revision History: April 08, 2026: Issued initial notification.April 30, 2026: Re-issued initial notification to update LF DAP Surface Prep from NiPdAu to Bare Cu in Pre and Post Change Summary Attachment.July 14, 2026: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on August 10, 2026. Product Category: Gate Drivers and Motor DriversDescription of Change: Qualification of MTAI as an additional assembly site for selected MIC4426, MIC4420, MIC4423, MIC4429, MIC4425, MIC4427, MIC4424, and MIC4428 device families available in 8L SOIC (3.90mm) package.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve on-time delivery performance by qualifying MTAI as an additional assembly site.Estimated First Ship Date: 10 August 2026 (date code: 2633)
Product Category: Gate Drivers and Motor DriversDescription of Change: Qualification of MTAI as an additional assembly site for selected MIC4426, MIC4420, MIC4423, MIC4429, MIC4425, MIC4427, MIC4424, and MIC4428 device families available in 8L SOIC (3.90mm) package.Reason for Change: To improve on-time delivery performance by qualifying MTAI as an additional assembly site.Estimated Qualification Completion Date: May 2026
***UPATE OF PCN118022/LOCATION AND TESTING CHANGE***Revision History: December 11, 2025: Issued initial notification.March 03, 2026: Issued final notification. Attached the Qualification Report. Provided the estimated first ship date to be on April 03, 2026.Product Category: Gate Drivers and Motor DriversNotification Subject: CCB 7957 Final Notice: Qualification of MTAI as an additional final test site and scan and pack site for MIC4424YM and MIC4424YM-TR catalog part numbers (CPN) available in 8L SOIC (.150in) package.Description of Change: Qualification of MTAI as an additional final test site and scan and pack site for MIC4424YM and MIC4424YM-TR catalog part numbers (CPN) available in 8L SOIC (.150in) package.Reason for Change: To improve manufacturability and on time delivery performance by qualifying MTAI as an additional final test site and scan and pack site.Estimated First Ship Date: 03 April 2026 (date code: 2614)
Description of Change: Qualification of MTAI as an additional final test site and scan and pack site for MIC4424YM and MIC4424YM-TR catalog part numbers (CPN) available in 8L SOIC (.150in) package.Reason for Change: To improve manufacturability and on time delivery performance by qualifying MTAI as an additional final test site and scan and pack site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: February 2026
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Part Status:
The MIC4424YM/4423/4425 family are highly reliable BiCMOS/DMOS buffer/driver/MOSFET drivers. They are higher output current versions of the MIC4426/4427/4428, which are improved versions of the MIC426/427/428. All three families are pin-compatible.
The MIC4423/4424/4425 drivers are capable of giving reliable service in more demanding electrical environments than their predecessors. They will not latch under any conditions within their power and voltage ratings. They can survive up to 5 V of noise spiking, of either polarity, on the ground pin. They can accept, without either damage or logic upset, up to half an amp of reverse current (either polarity) forced back into their outputs.
The MIC4423/4424/4425 series drivers are easier to use, more flexible in operation, and more forgiving than other CMOS or bipolar drivers currently available. Their BiCMOS/DMOS construction dissipates minimum power and provides rail-to-rail voltage swings. Primarily intended for driving power MOSFETs, the MIC4423/4424/4425 drivers are suitable for driving other loads (capacitive, resistive, or inductive) which require low-impedance, high peak currents, and fast switching times. Heavily loaded clock lines, coaxial cables, or piezoelectric transducers are some examples. The only known limitation on loading is that total power dissipated in the driver must be kept within the maximum power dissipation limits of the package.
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