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BD6220F-E2
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2500 per Reel
SOP-8
Surface Mount
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Title of change:Change in wafer factory from ROHM Wako to ROHM Hamamatsu and change in packaging materials and assembly factory due to production base reorganization.Detailed description of change:BeforeFront-End Process: ROHM Wako 0.6 BiCDMOS / Bipolar.Back-End Process: See Attachment. AfterFront-End Process: ROHM Hamamatsu 0.6 BiCDMOS / Bipolar.Back-End Process: See Attachment.Reason for change:We will restructure low-utilization, small-scale production lines and standardize materials to advance structural reforms that ensure a stable supply to our customers over the long term.Planned first ship date: September 30, 2026Sample available schedule: March 2, 2026
At ROHM Electronics Philippines, Inc., LSI production building will be relocated to a new building in order to avoid risks associated with the aging of the existing building (Building D) and to ensure a stable supply.There are no 4Ms-related changes in the products which relocated to the new production building. Therefore, we believe that product quality is equivalent.
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.