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Manufacturer Part #
MIC5305-1.8YML-TR
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5000 per Reel
MLF-6
Surface Mount
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*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
*****FPCN111595 UPDATE/LOCATION CHANGE*****Description of Change:August 18, 2025: Issued final notification. Attached the Qualification Report. Provided the estimatedfirst ship date to be on October 29, 2025Fabrication Site:OLD- Microchip Technology Tempe ? Fab 2(TMGR)NEW- Microchip Technology Colorado (MCSO)Wafer SizeOLD- 8"NEW- 6"
Description of Change: Qualification of UNIG as an additional final test site and scan and pack site for selected MIC5319, MIC2009, MIC2005, MIC5219, MIC47050, MIC5305, MIC5259, MIC5252, MIC5255, MIC5232 and MIC5247 device families available in 6L VDFN (2x2x0.9mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying UNIG as an additional final test site and scan and pack site.
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in various packages.Reason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2025
Description of Change: Qualification of UNIS as an additional assembly site for selected MIC5305, MIC2772, MIC2602, MIC5232 and MIC2601 device families available in 8L and 6L VDFN (2x2x0.9mm) packages.Reason for Change:To improve on-time delivery performance by qualifying UNIS as an additional assembly site.
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Micrel Inc., is a leading manufacturer of IC solutions for the worldwide analog, Ethernet and high bandwidth markets. The Company's products include high performance analog, power, advanced mixed-signal and radio frequency semiconductors; high speed communication, clock management, Ethernet switch and physical layer transceiver integrated circuits. These products address a wide range of rapidly growing end markets including cellular handsets, portable and enterprise computing, enterprise and home networking, wide area and metropolitan area networks and industrial equipment.
Linear regulators are Step-Down regulators only. There are 2 types of regulators, Shunt and series-pass regulators.
For IC linear voltage regulators, the regulator type determines the configuration of the pass device as well as the dropout voltage. Standard voltage regulators use an NPN Darlington configuration and have a dropout voltage between 1.5V and 2.2 V. Low dropout (LDO) regulators differ from standard regulators in that the pass device consists of a single PNP transistor.
Linear regulators provide significant advantages over switching regulators in simplicity, cost, and output noise. The only difference between a 'normal' linear regulator and a LDO one is that, the LDO type can have a lower constant voltage-drop across the series-pass element.
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