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TC1185-1.8VCT713
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3000 per Reel
SOT-23-5 (SOT-25)
Surface Mount
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*** Update for PCN 116914 ***Revision History: February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CTI/MCVAO. Issued initial notification.October 22, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on November 28, 2025. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Revised affected parts list.October 28, 2025: Revised affected parts list.November 3, 2025: Re-issued final notification to update affected parts list to add MCP9700T H/TTVAO-VW catalog part number. Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 28 November 2025 (date code: 2548)
*** Update for PCN 116870 ***Revision History: February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CT-I/MCVAO. Issued initial notification.October 22, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on November 28, 2025. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Revised affected parts list.October 28, 2025: Revised affected parts list.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 28 November 2025 (date code: 2548)
*** Update for PCN 115274 ***Revision History: August 15, 2025: Issued initial notification. October 28, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be November 17, 2025. Added a new column titled 'Change (Yes/No)' to the Pre and Post Change Summary table.Description of Change: Qualification of CRM-1151GA as a new die attach material for selected MCP1316, MCP1316M, MCP1317, MCP1318, MCP1318M, MCP1319, MCP1319M, MCP132x, MCP1824, MCP3021, MCP3221, MCP6001, MCP60x, MCP6021, MCP6231U, MCP6241U, MCP6271, MCP628x, MCP6291, MCP6401, MCP6401U, MCP6406, MCP6441, MCP654xU, MCP656x, MCP6G01, MCP6G01U, MCP6L01U, MCP6L1, MCP6L71, TC101x, TC105x, TC107x, TC118x, TC122x, TC201x, TC205x, TC218x and TC74 device families available in 5L & 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated First Ship Date: 17 November 2025 (date code: 2547)
** *UPDATE OF PCN111024 & PCN113243***Revision History: February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CT I/MCVAO. Issued initial notification.October 22, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on November 28, 2025. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Revised affected parts list.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Estimated First Ship Date: 28 November 2025 (date code: 2548)
***UPDATE OF PCN115155***Revision History: August 12, 2025: Issued initial notification.October 16, 2025: Issued final notification. Updated affected part list to removeDescription of Change: Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated First Ship Date: 06 November 2025 (date code: 2545)
***UPDATE OF PCN113920***Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material for selected MCP18x, MCP60x, MCP61x, MCP6Lx, MCP13x, MCP32x, MCP30x, TC74, MCP65x, MCP64x, MCP62x, MCP6Gx, TC118x, TC101x, TC107x, TC105x, TC122x, TC201x, TC218x, and TC205x device families available in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 19 August 2025 (date code: 2534)
Description of Change: Qualification of CRM-1151GA as a new die attach material for selected MCP1316, MCP1316M, MCP1317, MCP1318, MCP1318M, MCP1319, MCP1319M, MCP132x, MCP1824, MCP3021, MCP3221, MCP6001, MCP60x, MCP6021, MCP6231U, MCP6241U, MCP6271, MCP628x, MCP6291, MCP6401, MCP6401U, MCP6406, MCP6441, MCP654xU, MCP656x, MCP6G01, MCP6G01U, MCP6L01U, MCP6L1, MCP6L71, TC101x, TC105x, TC107x, TC118x, TC122x, TC201x, TC205x, TC218x and TC74 device families available in 5L & 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material. Estimated Qualification Completion Date: September 2025
Description of Change: Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material for selected MCP18x, MCP60x, MCP61x, MCP6Lx, MCP13x, MCP32x, MCP30x, TC74, MCP65x, MCP64x, MCP62x, MCP6Gx, TC118x, TC101x, TC107x, TC105x, TC122x, TC201x, TC218x, and TC205x device families available in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
*** Update for PCN 111024 ***Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: October 2025Revision History:February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CTI/MCVAO.
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It is designed specifically for battery-operated systems, the devices’ CMOS construction eliminates wasted ground current, significantly extending battery life.
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