Shipping Country
Free shipping within the continental US over $50. Conditions apply
Select Country
Manufacturer Part #
TLE4253EXUMA2
Download the CAD models for this product. Learn more about SnapMagic.
2500 per Reel
DSO-8
Surface Mount
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Subject: Introduction of copper wire bond for dedicated DOPL4_8 products.Description:PROCESS - ASSEMBLY: Change of wire bondingOld 25 Cu Bonding Wire.New 30 Cu Bonding WireReason:Copper wire bonding is part of Infineon’s continuous drive to deliver higher performance products. A copper wire enables superior electrical, thermal and reliability performance compared to gold, making it an excellent interconnect solution for automotive packaging.Anticipated impact of change:Based on the qualification performed, Infineon does not see any negative impact on quality, function and reliability. No change in fit, form, function.Intended start of delivery 2026-09-30
Description:Old:Products are tested on one or two of the below mentioned sites: Infineon Technologies AG, Regensburg, Germany. Infineon Technologies AG, Villach, Austria.Infineon Technologies Dresden GmbH & Co. KG, Dresden, Germany.Infineon Technologies (Kulim) Sdn. Bhd., Kulim, Malaysia.New:Products are tested on all of the below mentioned sites: Infineon Technologies AG, Regensburg, Germany AND Infineon Technologies AG, Villach, Austria AND Infineon Technologies Dresden GmbH & Co. KG, Dresden, Germany AND Infineon Technologies (Kulim) Sdn. Bhd., Kulim, Malaysia AND Infineon Technologies Manufacturing (Thailand), Samut Prakan, Thailand (BKK).Reason:Capacity expansion of wafer test within Infineon test cluster locations to assure continuity of supply and enable flexible manufacturing.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.