Manufacturer Part #
MCP16311T-E/MNY
MCP16311: 30 V 1 A Integrated Synchronous Switch Step-Down Regulator - TDFN-8
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| Mfr. Name: | Microchip | ||||||||||
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Product Variant Information section
Available PackagingPackage Qty:3300 per Reel |
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Microchip MCP16311T-E/MNY - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
*** Update for PCN 118000 ***Revision History: February 07, 2025: Issued initial notification.December 12, 2025: Issued final notification. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Provided estimated first ship date to be on February 20, 2026.December 15, 2025: Re-issued final notification. Updating the revision history that the provided estimated first ship date to be on December 15, 2025.Description of Change: Qualification of MMT as an additional assembly site for selected MCP16311, MCP16312, MCP16331, MCP2542FD, MCP2542WFD, MCP2544FD, MCP2544WFD, MCP2557FD, MCP2558FD, MCP6H01, MCP6H02, MCP6H71, MCP6H72, MCP6H91and MCP6H92 device families available in 8L TDFN (2x3x0.8mm) package.Reason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: 20 February 2026Estimated First Ship Date: 15 December 2025 (date code: 2551)
*** Update for PCN 110673 ***Revision History: February 07, 2025: Issued initial notification.December 12, 2025: Issued final notification. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Provided estimated first ship date to be on February 20, 2026Description of Change: Qualification of MMT as an additional assembly site for selected MCP16311, MCP16312, MCP16331, MCP2542FD, MCP2542WFD, MCP2544FD, MCP2544WFD, MCP2557FD, MCP2558FD, MCP6H01, MCP6H02, MCP6H71, MCP6H72, MCP6H91and MCP6H92 device families available in 8L TDFN (2x3x0.8mm) package.Reason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: 20 February 2026Estimated First Ship Date: 15 December 2025 (date code: 2551)
PCN Status:Initial NotificationDescription of Change:Qualification of MMT as an additional assembly site for selected MCP16311, MCP16312, MCP16331, MCP2542FD, MCP2542WFD, MCP2544FD, MCP2544WFD, MCP2557FD, MCP2558FD, MCP6H01, MCP6H02, MCP6H71, MCP6H72, MCP6H91and MCP6H92 device families available in 8L TDFN (2x3x0.8mm) package.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.
Revised the qualification report (Future PCN 41261)Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change: To improve manufacturability by qualifying molding compound and die attach material.
Final Notice: Qualification of G700LTD molding compound and 8600 die attach epoxy for selected DFN, TDFN, UDFN and VDFN packages at NSEB site.Description of Change:Qualification of G700LTD molding compound and 8600 die attach epoxy for 6L DFN (2x2x0.9mm), 8L DFN (2x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L TDFN (2x3x0.8mm), 8L UDFN (2x3x0.5mm), 10L UDFN (3x3x0.5mm), 8L VDFN (4x4x1.0mm) and 8L VDFN (5x5x1.0mm) packages at NSEB assembly site.Pre Change: G770HCD molding compound and 8200T die attach epoxyPost Change: G700LTD molding compound and 8600 die attach epoxyReason for Change:To improve manufacturability by qualifying molding compound and die attach material.
Part Status:
Available Packaging
Package Qty:
3300 per Reel