
Manufacturer Part #
TC1044SEOA
TC1044S Series +1.5 to +12 V Charge Pump DC-TO-DC Voltage Converter - SOIC-8
Microchip TC1044SEOA - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:-Added parameter “Switching Frequency” to “Electrical Characteristics” table. -Updated the Package Outline Drawings and Package Marking Information in Section 4.0 “Packaging Information”. -Added Section “Product Identification System.” -Added Appendix A: “Revision History.” -Minor changes throughout the text.Reason for Change: To improve productivity. Date Document Changes Effective: 03 Apr 2025
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for TC7107, TC7107A, TC7106, TC7106A, TC7660, TC1044S, TC623, TC682, TC7116, TC514, TC7662B, TC7117, TC510, TC4431, TC4432, TC624, TC7117A, TC7116A, TC7660S, TC7129 and TC7660H device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file calledTempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: August 2025Revision History: February 20, 2025: Issued initial notification.February 21, 2025: Re-issued initial notification to update the qualification plan.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for TC7107, TC7107A, TC7106, TC7106A, TC7660, TC1044S, TC623, TC682, TC7116, TC514, TC7662B, TC7117, TC510, TC4431, TC4432, TC624, TC7117A, TC7116A, TC7660S, TC7129 and TC7660H device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2 (TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Part Status:
Microchip TC1044SEOA - Technical Attributes
Topology: | Charge Pump |
Input Voltage: | 1.5V to 12V |
Output Current-Max: | 20mA |
Output Type: | Fixed |
Switching Frequency-Max: | 45kHz |
Operating Temp Range: | -40°C to +85°C |
Efficiency: | 98% |
No. of Outputs: | 1 |
Quiescent Current: | 80µA |
Storage Temperature Range: | -65°C to +150°C |
Package Style: | SOIC-8 |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
100 per Tube
Package Style:
SOIC-8
Mounting Method:
Surface Mount