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Manufacturer Part #
CAP1206-1-SL-TR
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2600 per Reel
SOIC-14
Surface Mount
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PCN Information:
Previous PCN # 113077Revision History:May 20, 2025: Issued initial notification.May 06, 2026: Issued final notification. Attached the qualification report. Added column "Change (Yes/No)" in the pre and post change table. Updated the pre and post change summary table and file to reflect units in mils instead of mm. Revised the affected parts list by removing EOL CPNs CAP1206-2-SL-TR, CAP1208-2-SL-TR, and CAP1298-2-SL-TR. Provided estimated first ship date to be on June 03, 2026. Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for CAP1206-1-SL, CAP1206-1-SL-TR, CAP1208-1-SL-TR, CAP1296-1-SL-TR, CAP1298-1-SL-TR, CAP1208-1-SL, CAP1296-1-SL, and CAP1298-1-SL catalog part numbers (CPN) available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve manufacturability by qualifying CuPdAu as a new bond wire material.
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected CAP1206-1-SL, CAP1206-1-SL-TR, CAP1206-2-SL-TR, CAP1208-1-SL-TR, CAP1208-2-SL-TR, CAP1296-1-SL-TR, CAP1298-1-SL-TR, CAP1298-2-SL-TR, CAP1208-1-SL, CAP1296-1-SL, and CAP1298-1-SL catalog part numbers (CPN) available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new bond wire material.
*****FPCN11180 FINAL NOTICE UPDATE*****Description of Change:Qualification of MTAI as a new final test site for selected CAP1203, CAP1206, CAP1208, CAP1293, CAP1296 and CAP1298 device families available in 8L and 14L SOIC (.150in) packages.Reason for Change: To improve on-time delivery performance and manufacturability by qualifying MTAI as a new final test site.
Description of Change: Qualification of MTAI as a new final test site for selected CAP1203, CAP1206, CAP1208, CAP1293, CAP1296 and CAP1298 device families available in 8L and 14L SOIC (.150in) packages.Reason for Change: To improve on-time delivery performance and manufacturability by qualifying MTAI as a new final test site.Estimated Qualification Completion Date:April 2025
Part Status:
On Order
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
