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Référence fabricant
MCP102T-195I/TT
MCP102 Series 1.9 V 80 ms Micropower Voltage Supervisor - SOT-23
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3000 par Reel Style d'emballage :SOT-23 (SC-59,TO-236) Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MCP102T-195I/TT - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
***UPDATE OF PCN113742***Revision History: June 12, 2025: Issued initial notification.August 04, 2025: Issued final notification. Attached qualification report. Provided estimated first ship date to be on August 21, 2025. Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP9700B, MCP130, MCP9700, MCP9700A, TC1047A, TC1047, MCP102, MCP9701, MCP9701A, TCM808, MCP1525, MCP1541 device families available in 3L SOT-23 (1.3mm) package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 21 August 2025 (date code: 2534)
***UPDATE OF PCN114280***Revision History: May 28, 2025: Issued initial notification. July 7, 2025: Issued final notification. Updated the Pre and Post Change Summary to include Backside Coat material. Attached the Qualification Report. Provided the estimated first ship date to be on July 24, 2025.July 14, 2025: Re-issued final notification to update the year of Final Issuance date.Description of Change: Qualification of CuPdAu as a new wire material for selected MCP100, MCP101, MCP102, MCP103, MCP111, MCP112, MCP120, MCP121, MCP130, MCP131, MCP1700, MCP809, MCP810, TC1272A, TCM809 and TCM810 device families available in 3L SOT-23 (1.3mm) package.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material.
*** Update for PCN 113228 ***Revision History: May 28, 2025: Issued initial notification. July 7, 2024: Issued final notification. Updated the Pre and Post Change Summary to include Backside Coat material. Attached the Qualification Report. Provided the estimated first ship date to be on July 24, 2025.Description of Change: Qualification of CuPdAu as a new wire material for selected MCP100, MCP101, MCP102, MCP103, MCP111, MCP112, MCP120, MCP121, MCP130, MCP131, MCP1700, MCP809, MCP810, TC1272A, TCM809 and TCM810 device families available in 3L SOT-23 (1.3mm) package.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material.Estimated First Ship Date: 24 July 2025 (date code: 2530)
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP9700B, MCP130, MCP9700, MCP9700A, TC1047A, TC1047, MCP102, MCP9701, MCP9701A, TCM808, MCP1525, MCP1541 device families available in 3L SOT-23 (1.3mm) package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated Qualification Completion Date: July 2025
Description of Change: Qualification of CuPdAu as a new wire material for selected MCP100, MCP101, MCP102, MCP103, MCP111, MCP112, MCP120, MCP121, MCP130, MCP131, MCP1700, MCP809, MCP810, TC1272A, TCM809 and TCM810 device families available in 3L SOT-23(1.3mm) package.Reason for Change:To improve manufacturability by qualifying CuPdAu as a new wire material.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Microchip has released a new Datasheet for the MCP102/MCP103/MCP121/MCP131 - Micropower Voltage Supervisors of devices.Description of Change:? Added automotive qualification to Features.? Added values for ESD protection to Absolute Maximum Ratings.? Updated Product Identification System.? Updated Packaging Information.Reason for Change: To Improve Productivity
Description of Change:Qualification of 84-3J/8006NS as a new die attach material for selected MCP10xT, MCP12xT and MCP13xT device families available in 3L SOT-23 (1.3mm) package at MTAI assembly site.Reason for Change:To improve manufacturability by qualifying 84-3J/8006NS as a new die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:February 28, 2023 (date code: 2309)
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP102T-195I/TT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--system-management--voltage-supervisors/mcp102t-195i-tt-microchip-7167919
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP102T-195I/TT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--system-management--voltage-supervisors/mcp102t-195i-tt-microchip-7167919
Microchip MCP102T-195I/TT - Caractéristiques techniques
| No of Outputs: | Single |
| Threshold Voltage: | 1.9|V |
| Supply Voltage-Max: | 5.5V |
| Reset Timeout: | 80ms |
| Style d'emballage : | SOT-23 (SC-59,TO-236) |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MCP102T-195I/TT is a Micropower Voltage Supervisor Device, designed to keep a microcontroller in reset until the system voltage has reached and stabilized at the proper level for reliable system operation, available in SOT-23B-3 package.
Features:
- Ultra low supply current: 1.75 µA
- Precision Monitoring options of : 1.90 V, 2.32 V, 2.63 V, 2.93 V, 3.08 V, 4.38 V and 4.63
- Resets microcontroller in a power-loss event
- RST pin (Active-low): Active-low, push-pull
- Reset Delay Timer (120 ms delay, typ)
- Temperature Range: Extended : -40 to 125°C
- Industrial : -40 to 85°C
- Pb-free devices
Applications:
- Critical Microcontroller and Microprocessor Power-monitoring Applications
- Computers
- Intelligent Instruments
- Portable Battery-powered Equipment
Emballages disponibles
Qté d'emballage(s) :
3000 par Reel
Style d'emballage :
SOT-23 (SC-59,TO-236)
Méthode de montage :
Surface Mount