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Référence fabricant
MCP809T-485I/TT
MCP809 Series 4.85 V 150 ms Microcontroller Supervisory Circuit - SOT-23-3
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3000 par Reel Style d'emballage :SOT-23 (SC-59,TO-236) Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2238 | ||||||||||
Microchip MCP809T-485I/TT - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
***UPDATE OF PCN114280***Revision History: May 28, 2025: Issued initial notification. July 7, 2025: Issued final notification. Updated the Pre and Post Change Summary to include Backside Coat material. Attached the Qualification Report. Provided the estimated first ship date to be on July 24, 2025.July 14, 2025: Re-issued final notification to update the year of Final Issuance date.Description of Change: Qualification of CuPdAu as a new wire material for selected MCP100, MCP101, MCP102, MCP103, MCP111, MCP112, MCP120, MCP121, MCP130, MCP131, MCP1700, MCP809, MCP810, TC1272A, TCM809 and TCM810 device families available in 3L SOT-23 (1.3mm) package.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material.
*** Update for PCN 113228 ***Revision History: May 28, 2025: Issued initial notification. July 7, 2024: Issued final notification. Updated the Pre and Post Change Summary to include Backside Coat material. Attached the Qualification Report. Provided the estimated first ship date to be on July 24, 2025.Description of Change: Qualification of CuPdAu as a new wire material for selected MCP100, MCP101, MCP102, MCP103, MCP111, MCP112, MCP120, MCP121, MCP130, MCP131, MCP1700, MCP809, MCP810, TC1272A, TCM809 and TCM810 device families available in 3L SOT-23 (1.3mm) package.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material.Estimated First Ship Date: 24 July 2025 (date code: 2530)
Description of Change: Qualification of CuPdAu as a new wire material for selected MCP100, MCP101, MCP102, MCP103, MCP111, MCP112, MCP120, MCP121, MCP130, MCP131, MCP1700, MCP809, MCP810, TC1272A, TCM809 and TCM810 device families available in 3L SOT-23(1.3mm) package.Reason for Change:To improve manufacturability by qualifying CuPdAu as a new wire material.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP809T-485I/TT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--system-management--voltage-supervisors/mcp809t-485i-tt-microchip-6388334
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP809T-485I/TT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--system-management--voltage-supervisors/mcp809t-485i-tt-microchip-6388334
Microchip MCP809T-485I/TT - Caractéristiques techniques
| No of Outputs: | Single |
| Threshold Voltage: | 4.85|V |
| Supply Voltage-Max: | 5.5V |
| Reset Timeout: | 150ms |
| Style d'emballage : | SOT-23 (SC-59,TO-236) |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MCP809T-485I/TT is a Voltage Supervisory device, designed to keep a microcontroller in reset until the system voltage has reached the proper level and stabilized. It is available in surface mount SOT-23-3 package.
Features:
- Resets microcontroller during power loss
- Precision monitoring of 3V, 3.3V and 5V systems
- Active low RESET pin (MCP809) or active high RESET (MCP810)
- Push-pull output
- Holds RESET for 350ms (typical)
- RESET to VDD = 1.0V
- Accuracy of +(-)125mV for 5V systems and +(-)75mV for 3V systems over temperature 45uA typical operating current
- Temp range: Industrial (I): -40°C to +85°C
Emballages disponibles
Qté d'emballage(s) :
3000 par Reel
Style d'emballage :
SOT-23 (SC-59,TO-236)
Méthode de montage :
Surface Mount