Manufacturer Part #
MCP2510T-I/SO
MCP2510 Series 5.5 V 1 Mb/s Stand Alone SPI Interface CAN Controller- SOIC-18
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1100 per Reel Package Style:SOIC-18 Mounting Method:Surface Mount | ||||||||||
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Microchip MCP2510T-I/SO - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 90K, 120K and 121K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Initial Notice: Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 90K, 120K and 121K wafer technologies available in 18L SOIC.Description of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 90K, 120K and 121K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change:To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Part Status:
Microchip MCP2510T-I/SO - Technical Attributes
| Interface: | SPI |
| Supply Voltage-Nom: | 3V to 5.5V |
| Package Style: | SOIC-18 |
| Mounting Method: | Surface Mount |
Features & Applications
The MCP2510T-I/SO is a Stand Alone CAN Controller with SPI Interface for implementing CAN specification V2.0 A/B with bit rate up to 1 Mb/s. Available in surface mount 18 pin SOIC package.
Features:
- Implements Full CAN V2.0A and V2.0B at 1 Mb/s:
- 0 - 8 byte message length
- Standard and extended data frames
- Programmable bit rate up to 1 Mb/s
- Support for remote frames
- Two receive buffers with prioritized message storage
- Six full acceptance filters
- Two full acceptance filter masks
- Three transmit buffers with prioritization and abort features
- Loop-back mode for self test operation
- Hardware Features:
- High Speed SPI Interface (5 MHz at 4.5V I temp)
- Supports SPI modes 0,0 and 1,1
- Clock out pin with programmable prescaler
- Interrupt output pin with selectable enables
- ‘Buffer full’ output pins configureable as interrupt pins for each receive buffer or as general
purpose digital outputs - ‘Request to Send’ input pins configureable as control pins to request immediate message
transmission for each transmit buffer or as general purpose digital inputs - Low Power Sleep mode
- Low power CMOS technology:
- Operates from 3.0V to 5.5V
- 5 mA active current typical
- 10 μA standby current typical at 5.5V
- 18-pin PDIP/SOIC and 20-pin TSSOP packages
- Temperature ranges supported:
- Industrial (I): -40°C to +85°C
- Extended (E): -40°C to +125°C
Available Packaging
Package Qty:
1100 per Reel
Package Style:
SOIC-18
Mounting Method:
Surface Mount