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Manufacturer Part #
MCP2518FDT-H/SL
Download the CAD models for this product. Learn more about SnapMagic.
2600 per Reel
SOIC-14
Surface Mount
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Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for MCP2517FD-H/SL, MCP2517FDT-H/SL, MCP2518FDT-E/SL and MCP2518FDT-H/SL catalog part numbers (CPN) available in 14L SOIC (.150in) packages at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: 26 May 2026 (date code: 2622)
Description:Microchip has released a new Document for the MCP2518FD Silicon Errata and Data Sheet Clarification of devices. If you are using one of these devices please read the document located at MCP2518FD Silicon Errata and Data Sheet Clarification.
Microchip has released a new Errata for the MCP2518FD Silicon Errata and Data Sheet Clarification of devices. Description of Change:? Clarification of Register 3-3: CRC - CRC Register was added to Section ?Clarifications/Corrections to the Data Sheet?.? Added SPI Module (entry no. 6).Reason for Change: To Improve Productivity
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
