
Manufacturer Part #
MCP23009-E/SO
MCP23009 Series 5.5 V 3.4 MHz 8-Bit I/O Expander with Open-Drain Output -SOIC-18
Microchip MCP23009-E/SO - Product Specification
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Microchip has released a new Datasheet for the MCP23009/MCP23S09 - 8-Bit I/O Expander with Open-Drain Outputs Data Sheet of devices.Description of Change:Added information about the Automotive Qualification status of the device in Section ?Features?.Clarified Section 3.1 ?Package Marking Information? to more closely match manufacturing standards.Updated Section ?Product Identification System?, with Automotive Qualified devices.Minor text and format changes throughout.
Initial Notice: Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOICDescription of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change:To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Part Status:
Microchip MCP23009-E/SO - Technical Attributes
Interface Type: | I2C |
No of Channels: | 1 |
Clock Frequency-Max: | 3.4MHz |
No of I/O Lines: | 8 |
Supply Voltage-Nom: | 1.8V to 5.5V |
Supply Current: | 1mA |
Package Style: | SOIC-18 |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
42 per Tube
Package Style:
SOIC-18
Mounting Method:
Surface Mount