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Manufacturer Part #
KSZ8081MNXIA-TR
10/100 BASE-TX PHYSICAL LAYER TRANSCEIVER
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1000 per Reel Package Style:QFN-32 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2422 | ||||||||||
Microchip KSZ8081MNXIA-TR - Product Specification
Shipping Information:
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PCN Information:
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 3280NP as a new die attach material for selected KSZ8051, KSZ8081, and KSZ8091 device families available in 32L VQFN (5x5x0.9mm) package at MTAI assembly site.Reason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 3280NP as a new die attach material.
Microchip has released a new Datasheet for the KSZ8081MNX/RNB 10BASE-T/100BASE-TX Physical Layer Transceiver Data Sheet of devices.Description of Change: DS000002202D (11-21-23) Features, Section 1.1, "General Description", Figure2-1, Figure2-2, Section8.0, Package Outline and Product Identification System Throughout document, updated Package Type from “QFN” to “VQFN”. Table2-1, "Pin Description — KSZ8081MNX" and Table2-3, "Pin Description — KSZ8081RNB" Updated INTRP resistor value from “1.0 k?” to “4.7k?”. Table3-2, "RMII Signal Definition" Updated to show RMII signals. Table3-10, "Typical Current/ Power Consumption (VDDA_3.3 = 3.3V, VDDIO = 3.3V)" and Table3-11, "Typical Current/Power Consumption (VDDA_3.3 = 3.3V, VDDIO = 2.5V)" Values for “3.3V Transceiver (VDDA_3.3)”, “3.3V Digital I/Os (VDDIO)” and “Total Chip Power” modified. Section3.4.2, RMII Back-toBack Mode (KSZ8081RNB Only) Added section. Table4-2, "Register Description" Updated register bit 18.6 to include both MII and RMII. Table7-7, "RMII Timing Parameters – KSZ8081RNB (50MHz input to XI pin)" Updated table title from “25 MHz” to “50 MHz”. Section8.0, Package Outline Updated/added Package drawings (Drawing, Dimensions and Land Pattern).
Description of Change:Qualification of a new lead frame with more Ag area on DAP surface prep for selected KSZ8081 and KSZ8091 device families available in 32L VQFN (5x5x0.9mm) package assembled at MTAI assembly site.Reason for Change:To improve productivity by qualifying new lead frame with more Ag area on DAP surface prep.Change Implementation Status:In ProgressEstimated First Ship Date:December 30, 2022 (date code: 2253)
Description of Change:Qualification of FH-SC13/HR-5104 as new die attach material and G700LTD mold compound for selected Atmel ATA5577M1330C-UFQW and ATA5577M133DC-UFQW catalog part numbers (CPN) available in 2L XDFN (1.5x2x0.37mm) package at NSEB assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying FH-SC13/HR-5104 as new die attach material and G700LTD mold compound at NSEB assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:January 15, 2023 (date code: 2303)
Description of Change:Qualification of a new lead frame with more Ag area on DAP surface prep for selected KSZ8081 and KSZ8091 device families available in 32L VQFN (5x5x0.9mm) package assembled at MTAI assembly site.Reason for Change:To improve productivity by qualifying new lead frame with more Ag area on DAP surface prep.
Part Status:
Microchip KSZ8081MNXIA-TR - Technical Attributes
| Supply Voltage-Nom: | 1.8V to 3.3V |
| No of Functions / Channels: | 1 |
| Interface Type: | MII |
| Package Style: | QFN-32 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
1000 per Reel
Package Style:
QFN-32
Mounting Method:
Surface Mount