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Manufacturer Part #
MAX24287ETK2
MAX24287 Series 3.3 V 10 uA 1Gbps Parallel-to-Serial MII Converter - TQFN-68
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:260 per Tray Mounting Method:Surface Mount | ||||||||||
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Microchip MAX24287ETK2 - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of G700LA as a new mold compound material for selected MAX24x8x device family available in 68L WQFN (8x8x0.8mm) package assembled at ASCL assembly siteImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying G700LA as a new molding compound material.Change Implementation Status:In ProgressEstimated First Ship Date:January 20,2023 (date code: 2303)
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MAX24287ETK2&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--comm-products--switch/max24287etk2-microchip-8034541
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MAX24287ETK2&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--comm-products--switch/max24287etk2-microchip-8034541
Microchip MAX24287ETK2 - Technical Attributes
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
260 per Tray
Mounting Method:
Surface Mount