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Manufacturer Part #
APT35GN120L2DQ2G
APT35GN120L2DQ2G Series 1200 V 94 A Through Hole NPT IGBT - TO-264
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:25 per Tube Package Style:TO-264 Mounting Method:Through Hole | ||||||||||
| Date Code: | |||||||||||
Microchip APT35GN120L2DQ2G - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: Qualification of Tin (Sn) as a new terminal plating for selected APL502, APL602, APT100, APT10M, APT11N, APT120, APT13G, APT150, APT15D, APT15G, APT200, APT20G, APT20M, APT25G, APT30D, APT30G, APT30M, APT30S, APT33G, APT35G, APT401, APT40D, APT40G, APT40M, APT45G, APT47N, APT501, APT502, APT50G, APT50M, APT601, APT602, APT603, APT60D, APT60M, APT60S, APT65G, APT75G, APT801, APT802, APT803, APT804, APT805, APT806, APT807, APT80G, APT94N, CC1105, CC1215, CC2515, CC3037, CC3038, CC3069 and CC3125 Microsemi Power Discrete TO-247 products.Reason for Change: To improve productivity by a change in terminal platingEstimated First Ship Date: 02 January 2026 (date code: 2601)
PCN Status:Final NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound.Change Implementation Status:In ProgressEstimated First Ship Date:June 29, 2024 (date code: 2426)
PCN Status:Initial NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Description of Change:Qualification of MCSO6 as an additional fabrication site for selected APT1xx, APT2xx, APT3xx, APT4xx, APT5xx, APT6xx and APT8xx device families available in various packages.Reason for Change:To improve productivity by qualifying MCSO6 as an additional fabrication site.Change Implementation Status:In ProgressEstimated First Ship Date:January 16, 2023 (date code: 2303)
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=APT35GN120L2DQ2G&field4=Microchip&field18=https://p1na.futureelectronics.com/en/p/semiconductors--discretes--transistors--igbts/apt35gn120l2dq2g-microchip-5232020
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=APT35GN120L2DQ2G&field4=Microchip&field18=https://p1na.futureelectronics.com/en/p/semiconductors--discretes--transistors--igbts/apt35gn120l2dq2g-microchip-5232020
Microchip APT35GN120L2DQ2G - Technical Attributes
| CE Voltage-Max: | 1200V |
| Collector Current @ 25C: | 94A |
| Power Dissipation-Tot: | 379W |
| Gate - Emitter Voltage: | ±30V |
| Pulsed Collector Current: | 105A |
| Collector - Emitter Saturation Voltage: | 1.7V |
| Turn-on Delay Time: | 24ns |
| Turn-off Delay Time: | 300ns |
| Qg Gate Charge: | 220nC |
| Reverse Recovery Time-Max: | 350ns |
| Leakage Current: | 600nA |
| Input Capacitance: | 2500pF |
| Thermal Resistance: | 0.33°C/W |
| Operating Temp Range: | -55°C to +150°C |
| No of Terminals: | 3 |
| Package Style: | TO-264 |
| Mounting Method: | Through Hole |
Available Packaging
Package Qty:
25 per Tube
Package Style:
TO-264
Mounting Method:
Through Hole