Orders shipping outside of United States will be on hold while the company evaluates tariff impacts.Please contact your salesperson for assistance.
Free shipping within the continental US over $50. Conditions apply
Manufacturer Part #
APT56M50L
APT56M50L Series 500 V 0.10 Ohm N-Channel Power Mosfet - TO-264-3
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:25 per Tube Package Style:TO-264AA Mounting Method:Through Hole | ||||||||||
| Date Code: | |||||||||||
Microchip APT56M50L - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of MG15F-0140B as a new mold compound material for various products available in SOT-227, TO-264, TO-268 and TO-247 packages at TEAM assembly site.Reason for Change:To improve productivity by qualifying MG15F-0140B as a new mold compound material at TEAM assembly site.***Issued final notification. Provided estimated first ship date to be on June 29, 2024.
PCN Status:Final NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound.Change Implementation Status:In ProgressEstimated First Ship Date:June 29, 2024 (date code: 2426)
PCN Status:Initial NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Description of Change:Qualification of MG15F-0140B as a new mold compound material for various products available in SOT-227, TO-264, TO-268 and TO-247 packages at TEAM assembly site.Reason for Change:To improve productivity by qualifying MG15F-0140B as a new mold compound material at TEAM assembly site.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=APT56M50L&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--discretes--transistors--mosfets/apt56m50l-microchip-6034613
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=APT56M50L&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--discretes--transistors--mosfets/apt56m50l-microchip-6034613
Microchip APT56M50L - Technical Attributes
| Product Status: | Active |
| Fet Type: | N-Ch |
| No of Channels: | 1 |
| Drain-to-Source Voltage [Vdss]: | 500V |
| Drain-Source On Resistance-Max: | 0.1Ω |
| Rated Power Dissipation: | 780W |
| Qg Gate Charge: | 220nC |
| Gate-Source Voltage-Max [Vgss]: | 30V |
| Drain Current: | 56A |
| Turn-on Delay Time: | 38ns |
| Turn-off Delay Time: | 100ns |
| Rise Time: | 45ns |
| Fall Time: | 33ns |
| Operating Temp Range: | -55°C to +150°C |
| Gate Source Threshold: | 4V |
| Input Capacitance: | 8800pF |
| Package Style: | TO-264AA |
| Mounting Method: | Through Hole |
Available Packaging
Package Qty:
25 per Tube
Package Style:
TO-264AA
Mounting Method:
Through Hole