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Manufacturer Part #
BSC097N06NSATMA1
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5000 per Reel
TDSON-8
Surface Mount
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Subject : Change of gate wire material to copper wire for dedicated OptiMOS? products in PG-TDSON-8 packageDescription :Old Wire bond material Gold (Au)New Wire bond material Copper (Cu) Reason: Copper wire bonding is part of Infineon?s continuous drive to deliver higher performance products. A copper wire enables superior electrical, thermal and reliability performance compared to gold, making it an excellent interconnect solution for industrial packagingIntended start of delivery 2026-10-30 or earlier, depending on customer approval
Detailed change informationSubject Extension of shelf lifetime from 3 to 5 years for products in SMD (Surface Mount Devices) and Leadless packagesReason Extension of shelf lifetime and product availabilityDescription Maximum storage timeOld - 3 years New- 5 yearsIntended start of delivery Immediately
Description:Upgrade of Max. Value of Operating and storage temperature for dedicated OptiMOS? products.Reason:Improvement of Product capability with new qualification conditions
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.