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Manufacturer Part #
SIZ340DT-T1-GE3
MOSFET 2N-CH 30V 30A SOT-23
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| Mfr. Name: | Vishay | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Reel Package Style:POWERPAIR 3x3 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2521 | ||||||||||
Vishay SIZ340DT-T1-GE3 - Product Specification
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Description:No Physical, Process, or Location Changes We want to emphasize that products continue to be manufactured at the same locations, using the same equipment, materials, packaging, and process steps as before. There have been no changes to any aspect of the production process or sites involved.BackgroundThis alignment is part of a global initiative at Vishay to ensure consistent representation of CoO information across all divisions, based on international and national regulations, as well as World Trade Organization guidelines.Please NoteSome customers may have already noticed changes in the CoO information on documentation accompanying recent product deliveries. As part of this ongoing initiative, updates to the CoO may continue to appear over time in product documentation, where applicable. These changes align with the updated approach and do not reflect any physical changes to the products themselves.
Vishay Siliconix Announces Manufacturing Capacity Expansion of BGBM Wafer Process for Commercial Power MOSFETs in PowerPAIR? PackagesDescription of Change: To meet increasing demand for commercial Power MOSFET products, Vishay Siliconix announces the qualification of wafer back-grind and back-metallization (BGBM) on select Commercial Power MOSFET in PowerPAIR? 3x3, PowerPAIR? 3x3FS, PowerPAIR? 6x5, and PowerPAIR? 6x5F packages at Prosperity Power Technology Inc.. ProPowertek, founded at the Hsinchu Science Park in Nov?20, aims to provide customers with engineering services for the center and backend wafer making process, and is devoted to leading the world in this market. ProPowertek is focusing on wafer thinning engineering, front side metal (FSM), backside grinding backside metal (BGBM), and IGBT back-end Turnkey solution in the local IC industry chain.
Description of Change: The wafer plating process for commercial power MOSFET products will move to a new building within the same Laguna Technopark. Classification of Change: In order to increase the capacity, Vishay Siliconix has moved the Philippines wafer plating facility in a larger building with the same equipment, same process, and same personnel.m Expected Influence on Quality/Reliability/Performance: There will be no effect on performance, quality or reliability and no change to form, fit, or function of the shipped devices.Vishay Brand(S): Vishay Siliconix Time Schedule: Start Shipment Date: Mon Feb 6, 2023
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=SIZ340DT-T1-GE3&field4=Vishay&field18=https://p1na.futureelectronics.com/p/semiconductors--discretes--transistors--mosfets/siz340dt-t1-ge3-vishay-3068200
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=SIZ340DT-T1-GE3&field4=Vishay&field18=https://p1na.futureelectronics.com/p/semiconductors--discretes--transistors--mosfets/siz340dt-t1-ge3-vishay-3068200
Vishay SIZ340DT-T1-GE3 - Technical Attributes
| Fet Type: | Dual N-Ch |
| No of Channels: | 2 |
| Drain-to-Source Voltage [Vdss]: | 30V |
| Drain-Source On Resistance-Max: | 0.0137Ω/0.007Ω |
| Rated Power Dissipation: | 3.7W/4.2W |
| Qg Gate Charge: | 9nC/16nC |
| Gate-Source Voltage-Max [Vgss]: | 20V |
| Drain Current: | 15.6A/22.6A |
| Turn-on Delay Time: | 20ns/33ns |
| Turn-off Delay Time: | 25ns/30ns |
| Rise Time: | 85ns/123ns |
| Fall Time: | 14ns |
| Operating Temp Range: | -55°C to +150°C |
| Gate Source Threshold: | 2.4V |
| Technology: | Si |
| Height - Max: | 0.8mm |
| Length: | 3.1mm |
| Input Capacitance: | 760pF/1552pF |
| Package Style: | POWERPAIR 3x3 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3000 per Reel
Package Style:
POWERPAIR 3x3
Mounting Method:
Surface Mount