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Manufacturer Part #
SQ4284EY-T1_GE3
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2500 per Reel
SOIC-8
Surface Mount
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Description of Change: The affected part number listed in this notification will be converted from gold (Au) bond wire to a copper (Cu) wire material set. The new ordering code is SQ4284CEY-T1_GE3 which has identical silicon technology and silicon die design as SQ4284EY. Small changes to the data sheet AC parameters are a consequence of lot to lot variation and/or updated characterization methods (reference: SQ4284CEY Doc # 61666 Rev. A). Device performance in the application will not be impacted. There will be no change to the wafer fab location. Reason for Change: Standardization of materialsTime Schedule: Last Time Buy Date: Monday November 23, 2026Last Time Ship Date: Monday May 17, 2027
Description:No Physical, Process, or Location Changes We want to emphasize that products continue to be manufactured at the same locations, using the same equipment, materials, packaging, and process steps as before. There have been no changes to any aspect of the production process or sites involved.BackgroundThis alignment is part of a global initiative at Vishay to ensure consistent representation of CoO information across all divisions, based on international and national regulations, as well as World Trade Organization guidelines.Please NoteSome customers may have already noticed changes in the CoO information on documentation accompanying recent product deliveries. As part of this ongoing initiative, updates to the CoO may continue to appear over time in product documentation, where applicable. These changes align with the updated approach and do not reflect any physical changes to the products themselves.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
