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Référence fabricant
TP2510N8-G
TP2510 Series 100 V 480 mA 3.5 Ohm P-Channel Vertical DMOS FET - TO-243AA
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :2000 par Reel Style d'emballage :SOT-89 (SC-62) Méthode de montage :Surface Mount | ||||||||||
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Microchip TP2510N8-G - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 111842 /Location Change***Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication site for multiple device families of DMOS2.5 (63K, 6K, 6FK, 6GK, 6HK) technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 08 October 2025 (date code: 2541)Revision History: March 26, 2025: Issued initial notification. September 04, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on October 08, 2025.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication site for multiple device families of DMOS2.5 (63K, 6K, 6FK, 6GK, 6HK) technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: July 2025
PCN Status:Initial NotificationDescription of Change:Qualification of GTBF as an additional assembly site for selected DNxxxxN8, TNxxxxN8, TPxxxxN8, VNxxxxN8 and VPxxxxN8 device families available in 3L SOT-89 package.Reason for Change:To improve on-time delivery performance by qualifying GTBF as an additional assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:November 2023
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=TP2510N8-G&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--discretes--transistors--mosfets/tp2510n8-g-microchip-4053439
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=TP2510N8-G&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--discretes--transistors--mosfets/tp2510n8-g-microchip-4053439
Microchip TP2510N8-G - Caractéristiques techniques
| Fet Type: | P-Ch |
| Drain-to-Source Voltage [Vdss]: | 100V |
| Drain-Source On Resistance-Max: | 3.5Ω |
| Rated Power Dissipation: | 1.6|W |
| Style d'emballage : | SOT-89 (SC-62) |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
2000 par Reel
Style d'emballage :
SOT-89 (SC-62)
Méthode de montage :
Surface Mount