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Manufacturer Part #
MSC060SMA070S
SiC,700V, 37A, 060MOHM, N-CH, TO-268
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:30 per Tube | ||||||||||
| Date Code: | |||||||||||
Microchip MSC060SMA070S - Product Specification
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PCN Information:
Description of Change:Implement packing material changes for selected PSDS and SIC products available in SOT-227, TO-220, TO-247, TO-263 and TO-268 packages at FSTS and TEAM final test sites.Reason for Change:To improve productivity by implementing packing material changes for selected PSDS and SIC products.
Microchip has released a new Datasheet for the MSC060SMA070S 700V, 60 mOhm mSiC™ MOSFET TO-268 Datasheet of devices. Notification Status: FinalDescription of Change:• Document migrated from Microsemi template to Microchip template; Assigned Microchip literature number DS-00005363A, which replaces the previous Microsemi literature number 050-7748.• Updated values in Table 1-1, Table 1-4, and Table 1-5.• Updated values for RDS(on), VGS(th), and IDSS in Table 1-3.• Updated 1.3. Typical Performance Curves and 2.1. Package Outline Drawing.• Added 2.2. Recommended Land Pattern.Impacts to Data Sheet: See above details.Reason for change: To improve productivity.Change Implementation Status: CompleteDate Document Changes Effective: 15 Aug 2024
Revision History:May 12, 2023: Issued initial notification.May 28, 2024: Issued cancellation notificationDescription of Change:This qualification was originally performed to qualify Microchip Technology Colorado – Fab 5 (MCSO) as an additional fabrication site for selected 700V, 1200V and 1700V SiC MOSFET products of MSCxxxSMA070xx, MSCxxxSMA120xx, MSCxxxSMA170xx device families available in die sales products, 2L TO-268, 4L SOT-227, 3L/4L TO-247 and 7L TO-263.Reason for Change:Microchip has decided to not qualify Microchip Technology Colorado – Fab 5 (MCSO) as an additional fabrication site for selected 700V, 1200V and 1700V SiC MOSFET products of MSCxxxSMA070xx, MSCxxxSMA120xx, MSCxxxSMA170xx device families available in die sales products, 2L TO-268, 4L SOT-227, 3L/4L TO-247 and 7L TO-263.
Revision History:February 26, 2024: Issued initial notification.May 24, 2024: Issued final notification. Provided estimated first ship date to be on June 29, 2024.Description of Change:Qualification of MG15F-0140B as a new mold compound for selected MSC01xx, MSC03xx, MSC09xx, MSC18xx, MSC04xx, MSC05xx, MSC36xx, MSC06xx, MSC02xx, MSC75xx, and MSC08xx device families available in 2L TO-268 package.Reason for Change:To improve manufacturability by qualifying MG15F-0140B as a new mold compound.
Description of Change:Qualification of MG15F-0140B as the new mold compound for selected MSC01xx, MSC03xx, MSC09xx, MSC18xx, MSC04xx, MSC05xx, MSC36xx, MSC06xx, MSC02xx, MSC75xx, and MSC08xx device families available in 2L TO-268 package.Reason for Change:To improve manufacturability by qualifying MG15F-0140B as the new mold compound.
Revision History:May 09, 2023: Issued initial notification.December 05, 2023: Re-issued initial notification to add MSC025SMA120D/S-C25, MSC017SMA120D/S-C25, MSC040SMA120D/S-C25, MSC080SMA120D/S-C25,MSC015SMA070D/S-C25, MSC060SMA070D/S-C25, MSC035SMA170D/S-C25 catalog part numbers (CPNs) in the affected parts list.Revision of Qual Report Availability and Final PCN Issue Date from “September 29, 2023” to “August 30, 2024”.Description of Change:Implementation of Die Overcoat material with Polyimide layer selected Microsemi SIC MOSFET product of MSCxxxSMA070, MSCxxxSMA120, and MSCxxxSMA170 devicefamilies in DICE, SOT-227, TO-247, TO-263 and TO-268 packages.Reason for Change:To improve productivity by implementing Die Overcoat (polyimide layer)
Description of Change:Qualification Microchip Technology Colorado ? Fab 5 (MCSO) as an additional fabrication site for selected 700V, 1200V and 1700V SiC MOSFET products of MSCxxxSMA070xx, MSCxxxSMA120xx, MSCxxxSMA170xx device families available in die sales products, 2L TO-268, 4L SOT-227, 3L/4L TO-247 and 7L TO-263.Reason for Change:To improve productivity and on-time delivery performance by qualifying MCSO as an additional fabrication site.
Description of Change:Implementation of Die Overcoat material with Polyimide layer selected Microsemi SIC MOSFET product of MSCxxxSMA070, MSCxxxSMA120, and MSCxxxSMA170 device families in DICE, SOT-227, TO-247, TO-263 and TO-268 packages.Reason for Change:To improve productivity by implementing Die Overcoat (polyimide layer)
PCN Status:Final NotificationDescription of Change:Implement top marking changes for selected PSDS (Power Switching Discrete Solutions) Silicon Carbide (SiC) Products available in TO-247, TO-263, TO-268, TO-220 and SOT-227 packages.Reason for Change:To improve productivity by standardizing the top marking as part of the integration of Microsemi and Microchip.Change Implementation Status:In ProgressEstimated First Ship Date:March 31, 2023 (date code: 2313)
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MSC060SMA070S&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--discretes--transistors--silicon-carbide-mosfets-sic-mosfets/msc060sma070s-microchip-6190965
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MSC060SMA070S&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--discretes--transistors--silicon-carbide-mosfets-sic-mosfets/msc060sma070s-microchip-6190965
Available Packaging
Package Qty:
30 per Tube