Manufacturer Part #
SY58604UMG-TR
4.25GBPS LVPECL BUFFER W/ FSI INPUTS
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1000 per Reel Package Style:MLF-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip SY58604UMG-TR - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
**Update to previous FPCN 98050******Revise affected parts list to remove SY89829UHY, SY89829UHY-TR and SY55856UHG catalog part number since these parts were EOL?ed****Description of Change:Qualification of UNIG as a new final test site for various products available in Tube and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Part Status:
Microchip SY58604UMG-TR - Technical Attributes
| Input Voltage-Max: | 4V |
| Temperature Range: | -40°C to +85°C |
| Supply Voltage-Nom: | 2.375V to 3.6V |
| Frequency-Max: | 3GHz |
| Package Style: | MLF-8 |
| Mounting Method: | Surface Mount |
Features & Applications
The SY58604UMG TR is a Part of SY58604U Series, 2.5 V/3.3 V, high-speed, fully differential LVPECL buffer optimized to provide less than 10ps pp total jitter. The SY58604U can process clock signals as fast as 2.5 GHz or data patterns up to 3.2 Gbps
It comes in a Package of MLF-8 and its operting temperature ranges from -40 °C to 85 °C.
Features:
- Precision 800 mV LVPECL buffer
- Guaranteed AC performance over temperature and voltage:
- DC-to > 3.2 Gbps throughput
- <350 ps typical propagation delay ( IN-to-Q)
- <110 ps rise/fall times
- Fail Safe Input
- Prevents output from oscillating when input is invalid
- Ultra-low jitter design
- <1 ps RMS cycle-to-cycle jitter
- <10 ps PP total jitter
- <1 ps RMS random jitter
- <10 ps PP deterministic jitter
- High-speed LVPECL output
- 2.5 V ±5% or 3.3 V ±10% power supply operation
- Available in 8-pin (2mm x 2mm) MLF package
Applications:
- All SONET clock and data distribution
- Fibre Channel clock and data distribution
- Gigabit Ethernet clock and data distribution
- Backplane distribution
Available Packaging
Package Qty:
1000 per Reel
Package Style:
MLF-8
Mounting Method:
Surface Mount