Manufacturer Part #
24LC16 Series 16 Kb I2C 2 Wire (2K X 8) 2.5 V Serial EEPROM SMT - TSSOP-8
|Standard Pkg:|| |
Product Variant Information section
100 per Tube
Microchip has released a new Product Documents for the 24AA16/24LC16B/24FC16 Data Sheet of deviceDescription of Change: Replaced terminology Master and Slave with Host and Client respectively. Changed MUY with Q4B part number for UDFN package. Updated PDIP, SOIC, TSSOP and UDFN package drawings. Added Automotive Product Identification System. Reason for Change: To Improve Productivity Date Document Changes Effective: 17 Mar 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Description of Change:Qualification of ASSH as a new assembly site for selected 24xx01, 24xx02, 24xx04, 24xx08 and 24xx16 device families available in 8L TSSOP package.Pre Change:Assembled at MMT using gold (Au) bond wire, 2200D die attach material, G600V molding compound material, with Matte tin lead plating finish and using lead frame without lead lockPost Change:Assembled at ASSH using palladium coated copper (PdCu) bond wire, EN-4900GC die attach material, G700LY molding compound material, with Ru-PPF lead plating finish and using lead frame with lead lockPre and Post Change Summary: see attachedImpacts to Data Sheet: NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying ASSH as a new assembly site. Change Implementation Status:In ProgressEstimated First Ship Date:February 9, 2021 (date code: 2107)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary:see attachedRevision History:January 18, 2021: Issued final notification. Attached the Qualification Report. Provided estimated first shipdate to be on February 9, 2021.
Notification subject: Memo # ML01202000QB: Final Notice: Qualification of 36.3K process technology for selected Microchip products of the 24xx08 and 24xx16 device families.PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of 36.3K process technology for selected Microchip products of the 24xx08 and 24xx16device families.Pre Change: Available in 160K wafer technology fabricated at Microchip fabrication sites FAB2 and FAB4 (Tempe, AZ and Gresham, OR, USA) using 8 inch wafersPost Change: Available in 160K wafer technology fabricated at Microchip fabrication sites FAB2 and FAB4 (Tempe, AZ and Gresham, OR, USA) using 8 inch wafers or available in 36.3K wafer technology fabricated at FAB 5 (Colorado Springs, CO, USA) using 6 inch wafers.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change: To improve manufacturability by qualifying an additional fabrication site.Change Implementation Status: In ProgressEstimated First Ship Date: April 15, 2020 (date code: 2016)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts
Revision History:December 19, 2019: Issued datasheet DS20001703MJanuary 16, 2020: Re-Issued datasheet DS20001703M by narrowing the scope to affect only parts based on the device selection table.Description of Change:1) Added the 24FC16 device 2) Updated Package Drawings 3) Updated formating throughout for clarification.Reason for Change: To Improve ManufacturabilityDate Document Changes Effective: 16 Jan 2020.NOTE: Please be advised that this is a change to the document only the product has not been changed.
|Memory Organization:||2 K x 8|
|Supply Voltage-Nom:||2.5V to 5.5V|
|Write Cycle Time-Max (tWC):||5ms|
|Mounting Method:||Surface Mount|
Features & Applications
The 24AA16/24LC16B (24XX16*) series of 16 Kbit Electrically Erasable PROM is organized as eight blocks of 256 x 8-bit memory with a 2-wire serial interface. Low-voltage design permits operation down to 1.7 V with standby and active currents of only 1 μA and 1 mA, respectively.
The 24XX16 also has a page write capability for up to 16 bytes of data. The 24XX16 is available in the standard 8-pin PDIP, surface mount SOIC, TSSOP, 2x3 DFN and MSOP packages, and is also available in the 5-lead SOT-23 package.
- Single supply with operation down to 2.5 V for 24LC16B devices
- Low-power CMOS technology
- 2-wire serial interface, I2C™ compatible
- Schmitt Trigger inputs for noise suppression
- Output slope control to eliminate ground bounce
- 100 kHz (2.5 V) and 400 kHz clock compatibility
- Page write time 5 ms max.
- More than 1 million erase/write cycles
- Data retention > 200 years
100 per Tube