
Manufacturer Part #
24LC256T-I/ST
24LC256 Series 256 Kb I2C 2 Wire (32K X 8) 2.5 V Serial EEPROM - TSSOP-8
Microchip 24LC256T-I/ST - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of ASSH as a new assembly site and as an additional final test site for 24AA256, 24LC256 and 24FC256 device families available in 8L TSSOP (4.4mm) package.Reason for Change:To improve manufacturability by qualifying ASSH as a new assembly site and as an additional final test siteChange Implementation Status:In progressEstimated First Ship Date:January 10, 2023 (date code: 2302)
PCN Status:Final NotificationDescription of Change:Qualification of UMC Fab 8D as an additional fabrication site for selected 24FC256, 24AA256 and 24LC256 device families available in 8L DFN-S (6x5x0.9mm), MSOP (3x3mm), PDIP (.300in), SOIC (3.90mm), SOIJ (.208in), TDFN (2x3x0.8mm), TSSOP (4.4mm) packages.Reason for Change:To improve manufacturability by qualifying UMC Fab 8D as an additional fabrication site.Change Implementation Status:In ProgressEstimated First Ship Date:September 19, 2022 (date code: 2239)
Microchip has released a new Datasheet for the 24AA256/24LC256/24FC256 256K I2C Serial EEPROM Data Sheet of devices.Notification Status: FinalDescription of Change: Added 5-Lead SOT-23 package. Updated MSOP, PDIP, SOIC and SOIJ package drawings.Impacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 28 Jul 2022
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 8L TSSOP (4.4mm) package assembled at MMT assembly site.Impacts to Data Sheet:NoneReason for Change:To improve on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Change Implementation Status:In ProgressEstimated First Ship Date:March 17, 2022 (date code: 2212)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 8L TSSOP (4.4mm) package assembled at MMT assembly site.Reason for Change:To improve on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.
Part Status:
Microchip 24LC256T-I/ST - Technical Attributes
Memory Density: | 256kb |
Memory Organization: | 32 K x 8 |
Supply Voltage-Nom: | 2.5V to 5.5V |
Clock Frequency-Max: | 400kHz |
Write Cycle Time-Max (tWC): | 5ms |
Package Style: | TSSOP-8 |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
2500 per Reel
Package Style:
TSSOP-8
Mounting Method:
Surface Mount