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Manufacturer Part #
AT24C512C-SSHM-T
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4000 per Reel
SOIC-8
Surface Mount
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Description of Change: Qualification of MMT as an additional assembly site for selected AT24C32E, AT24C64D, 24CS32, 24CS64, AT24C32D, 24AA64, 24FC64, 24AA32AF, 24LC64, 24LC32AF, 24LC32A, AT24C64B, 24AA32A, 24AA64F, 24LC64F, 24FC64F, AT24C128C, 24LC128, 24FC128, 24AA128, 24CS128, 24AA256, AT24C256C, 24LC256, 24CS256, 24FC256, AT24CM01, 24FC1025, 24LC1025, 24LC1026, 24AA1025, 24FC1026, 24AA1026, 24CSM01, 24CW640, 24CW320, 24CW160 and 24CW1280 device families, qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material for selected AT24C512C, 24AA512, 24LC512, 24FC512 and 24CS512 device families at MMT assembly site available in 8L SOIC (3.90mm) package.Reason for Change: To improve on-time delivery performance and manufacturability by qualifying MMT as an additional assembly site, palladium coated copper with gold flash (CuPdAu) as a new bond wire material and QMI519 as a new die attach material.Estimated First Ship Date: 26 May 2026 (date code: 2622)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Revision History:May 04, 2023: Issued initial notification.January 10, 2024: Issued final notification. Attached the Qualification Report. Updated the LF material, Paddle size and Die Attach material of MTAI in the Pre and Post Change Summary. Provided estimated first ship date to be on January 26, 2024.January 30, 2024: Re-issued final notification to update Pre and Post Change Summary.Description of Change:Qualification of MTAI as an additional assembly site for selected AT24C512C-SSHxx, AT24CM01-SSHxx and AT24CM02-SSHxx device families available in 8L SOIC (3.90mm(.150in)) package.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve productivity by qualifying MTAI as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:January 26, 2024 (date code: 2404)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
Revision History:\May 04, 2023: Issued initial notification.January 10, 2024: Issued final notification. Attached the Qualification Report. Updated the LF material, Paddle size and Die Attach material of MTAI in the Pre and Post Change Summary. Provided estimated first ship date to be on January 26, 2024.Description of Change:Qualification of MTAI as an additional assembly site for selected AT24C512C-SSHxx, AT24CM01-SSHxx and AT24CM02-SSHxx device families available in 8L SOIC (3.90mm(.150in)) package.additional assembly site for selected AT24C512C-SSHxx, AT24CM01-SSHxx and AT24CM02-SSHxx device families available in 8L SOIC (3.90mm(.150in)) package.
Description of Change:Qualification of MTAI as an additional assembly site for selected AT24C512C-SSHxx, AT24CM01-SSHxx and AT24CM02-SSHxx device families available in 8L SOIC (3.90mm(.150in)) package.Reason for Change:To improve productivity by qualifying MTAI as an additional assembly site.
Part Status:
On Order
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
