Orders shipping outside of United States will be on hold while the company evaluates tariff impacts.Please contact your salesperson for assistance.
Free shipping within the continental US over $50. Conditions apply
Manufacturer Part #
MX30LF2G18AC-TI
MX30LF2G18AC 2 Gb (256 M x 8) 2.7 to 3.6 V 20 ns NAND Flash Memory - TSOP-48
| | |||||||||||
| | |||||||||||
| Mfr. Name: | Macronix | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:96 per Tray Package Style:TSOP-48 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Macronix MX30LF2G18AC-TI - Product Specification
Shipping Information:
ECCN:
PCN Information:
Change Descritption:Please be informed that Macronix?s assembly subcontractor?SPIL is ongoing to continue the assemblyfor Macronix TSOP and CSPpackage products for one year and take the last order on Aug. 30th, 2026,then the assembly will be terminated. To continue the production, Macronix has started to survey and qualify a new assembly subcontractor for replacement --ChipMOS, OSE, ASECLand LINGSEN.For products currently assembled at SPIL, customers can issue last order for SPIL assembled parts before Aug. 30th, 2026(last order date), and then Macronix will maintain the SPIL assembled stock, until the last shipment date designated by the customer before Aug. 30th, 2027(last ship date).
Cancellation of Future PCN 115780 issued as Discontinuation.Per supplier's confirmation, This PCN is is NOT the product end of life, but it's the assembly house, SPIL packaging end of life.Macronix is in the process of qualifying additional assembly site(s) to replace SPIL and we will have the new assembly site products ready in April of 2026 well before the LTB and LTS from SPIL.Please make sure your sales people and customer know that Macronix will continue to support these EPNs indefinitely - currently from SPIL and then replace by alternate assembly sites in late 2026.Change Description:Please be informed that Macronix?s assembly subcontractor, SPIL, will discontinue TSOP and CSP package assembly services for Macronix products. Customers are offered the opportunity to place Last Time Buy orders by August 30, 2026. Additionally, Macronix will retain inventory of SPIL-assembled products for up to one year ? Last Time Ship by August 30, 2027.Macronix is currently evaluating alternative subcontractors to replace SPIL. The target assembly subcontractors include ChipMOS, OSE, ASECL, and/or LINGSEN. A Product Change Notification (PCN) for these new assembly sites is planned for release around April 2026. Customers will then be able to request samples and approve the new assembly sites.
Reprocess PCN Future PCN 115780 from Discontinuation to Location Change:Per attached supplier's confirmation, PCN is NOT the product end of life, it's the assembly house, SPIL packaging end of life.Macronix is in the process of qualifying additional assembly site(s) to replace SPIL and we will have the new assembly site products ready in April of 2026 well before the LTB and LTS from SPIL.Please make sure your sales people and customer know that Macronix will continue to support these EPNs indefinitely - currently from SPIL and then replace by alternate assembly sites in late 2026.Change Description:Please be informed that Macronix?s assembly subcontractor, SPIL, will discontinue TSOP and CSP package assembly services for Macronix products. Customers are offered the opportunity to place Last Time Buy orders by August 30, 2026. Additionally, Macronix will retain inventory of SPIL-assembled products for up to one year ? Last Time Ship by August 30, 2027. Macronix is currently evaluating alternative subcontractors to replace SPIL. The target assembly subcontractors include ChipMOS, OSE, ASECL, and/or LINGSEN. A Product Change Notification (PCN) for these new assembly sites is planned for release around April 2026. Customers will then be able to request samples and approve the new assembly sites.Reason of Change: Due to capacity allocation, SPIL decided to EOL all Macronix? TSOP and CSP package production at SPIL
Change Description:Please be informed that Macronix?s assembly subcontractor, SPIL, will discontinue TSOP and CSP package assembly services for Macronix products. Customers are offered the opportunity to place Last Time Buy orders by August 30, 2026. Additionally, Macronix will retain inventory of SPIL-assembled products for up to one year ? Last Time Ship by August 30, 2027. Macronix is currently evaluating alternative subcontractors to replace SPIL. The target assembly subcontractors include ChipMOS, OSE, ASECL, and/or LINGSEN. A Product Change Notification (PCN) for these new assembly sites is planned for release around April 2026. Customers will then be able to request samples and approve the new assembly sites.Reason of Change: Due to capacity allocation, SPIL decided to EOL all Macronix? TSOP and CSP package production at SPIL
Description:Please be informed that Macronix?s assembly subcontractor ? SPIL is ongoing to continue the assembly for Macronix TSOP and CSP package products for one year and take the last order on Aug. 30th, 2026, then the assembly will be terminated. To continue the production, Macronix has started to survey and qualify a new assembly subcontractor for replacement -- ChipMOS, OSE, ASECL and LINGSEN. For products currently assembled at SPIL, customers can issue last order for SPIL assembled parts before Aug. 30th, 2026 (last order date), and then Macronix will maintain the SPIL assembled stock, until the last shipment date designated by the customer before Aug. 30th, 2027 (last ship date)Reason of Change:Due to capacity allocation, SPIL decided to EOL all Au wire assembly line, which includes Macronix? TSOP and CSP package production at SPIL.Last order date for SPIL TSOP and CSP package products: 2026/8/30Last shipping date for SPIL TSOP and CSP package products: 2027/8/30
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MX30LF2G18AC-TI&field4=Macronix&field18=https://p1na.futureelectronics.com/p/semiconductors--memory--flash--nand/mx30lf2g18ac-ti-macronix-6096661
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MX30LF2G18AC-TI&field4=Macronix&field18=https://p1na.futureelectronics.com/p/semiconductors--memory--flash--nand/mx30lf2g18ac-ti-macronix-6096661
Macronix MX30LF2G18AC-TI - Technical Attributes
| NAND Type: | SLC |
| Memory Type: | Non-Volatile |
| Memory Format: | Flash |
| Memory Density: | 2Gb |
| Memory Organization: | 256 M x 8 |
| Supply Voltage-Nom: | 2.7V to 3.6V |
| Access Time-Max: | 20ns |
| Operating Temp Range: | -40°C to +85°C |
| Interface: | Parallel |
| Package Style: | TSOP-48 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
96 per Tray
Package Style:
TSOP-48
Mounting Method:
Surface Mount