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SST39VF010-70-4C-NHE-T
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750 per Reel
PLCC-32
Surface Mount
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Description of Change: Qualification of 3280NP as an additional die attach material for selected PIC16Cxx, PIC17Cxx, PIC18Fxx, PIC18Cxx, A40MX0xx, AT89C5xx, TC7117xx, TC7106xx, TC7107xx, TC850xx, TC7116xx, TC7109xx, PIC16Fxx, AY0438xx, HV518xx, HV5222xx, HV5308xx, HV9308xx, HV9408xx, HV5408xx, TC7129xx, MM5450xx, MM5451xx, ATF150xx, AT80C5xx, AT89LPxx, AT89S5xx, AT89LSxx, AT89S8xx, ATF250xx, AT27BVxx, AT27C2xx, MT8812xx, MT8816xx, MT093xx, HV5122xx, AT27C1xx, AT27C4xx, HV5622xx, HV5630xx, LE58QLxx, ATmega8515, ATF16Lxx, AT17LVxx, ATF16Vxx, TC1443xx, HV5812xx, HV2022xx, HV2301xx, HV2201xx, HV219xx, ATF22Vxx, ATF750xx, MIC58Pxx, MIC59Pxx, MIC580xx, ATF22Lxx, SY100Exx, MT8952xx, MT9171xx, MT9172xx, MT9122xx, MT8808xx, MT8806xx, COM200xx, A42MX2xx, A42MX0xx, A42MX1xx, AT27C0xx, AT27LVxx, AT28C0xx, AT28LVxx, AT28HCxx, AT28C2xx, AT28BVxx, AT28C6xx, AT27C5xx, SST39Sxx, SST39Lxx, SST39Vxx, SST49Lxx and LE79R7xx device families available in various packages.Reason for Change: To improve manufacturability by qualifying 3280NP as an additional die attach material.Change Implementation Status: In ProgressEstimated Qualification Completion Date: June 2026
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Microchip has released a new Datasheet for the SST39LF010/SST39LF020/SST39LF040/SST39VF010/SST39VF020/SST39VF040 - 1-Mbit/2-Mbit/4-Mbit (x8) Multi-Purpose Flash of devices. Updated TSOP package marking; Minor editorial updates throughout the document.Reason for Change: To Improve ProductivityDate Document Changes Effective: 12 Jun 2025
Description of Change:Updated Package Marking sectionData Sheet - SST39LF010/SST39LF020/SST39LF040/SST39VF010/SST39VF020/SST39VF040Reason for Change: To Improve Productivity.
Description of Change:Replaced WHE package type with TU package typeReason for Change: To improve productivity
Revision History:August 8, 2022: Issued initial notification.November 18, 2022: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 9, 2022.Description of Change:Qualification of MTAI as a new final test site for selected SST39LF0xx and SST39VF0xx device families available in 32L PLCC (11.5x14x3.37mm) package.Reason for Change:To improve productivity by qualifying MTAI as a new final test site.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
