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Manufacturer Part #
S25FL512SAGMFI011
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47 per Tube
SOIC-16
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
Description:Data sheet update to clarify the functionality of write in progress and ECCRD status register for FLS productsReason:Update of data sheet to more accurately reflect the functionality of the ECC read and write in progress (WIP)
Description:Change of wire bond from Cu to CuPdAu for industrial graded SOIC 16L packaged productsReason:Product harmonization of bond wire usage. CuPdAu wire enables superior electrical, thermal and reliability performance, making it an excellent interconnect solution for packaging to ensure business continuity and supply by streamlining its production.LTB - 2025-05-12LTS - 2025-08-12
Description:The Cypress PCN204905 (PCN N? 2020-184-A), dated 2020-12-14 has been cancelled.Qualification of Amkor Assembly & Test (Shanghai) Co., Ltd. as an Additional Backend Test Site for Select Memory Solutions NOR Flash Products
Detailed change information:Change of lot naming convention in Infineon Technologies (Thailand) Limited, Nonthaburi, Thailand for subject memory productsReason:The lot numbering identification changing from 10 digit to 11 digit for whole Bangkok site according to the global Infineon standardlot numbering system manufacturing strategy.
Part Status:
On Order
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.