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Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
Référence fabricant
SST25VF040B-50-4I-QAF-T
SST25VF Series 4 Mbit 512 K x 8 3 V Surface Mount SPI Serial Flash - WSON-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :2000 par Reel Style d'emballage :WSON-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip SST25VF040B-50-4I-QAF-T - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
PCN Status:Final NotificationDescription of Change:Qualification of NSEB and UTL3 as additional assembly sites for selected SST25PF0xx, SST2xVF0xx, USBF1600x and USBF8100x device families available in 8L TDFN-S (6x5x0.8mm) package.Reason for Change:To improve on-time delivery performance by qualifying UTL3 and NSEB as an additional assembly sites.Change Implementation Status:In ProgressEstimated First Ship Date:May 31, 2024 (date code: 2422)
PCN Status:Final NotificationDescription of Change:Qualification of NSEB and UTL3 as additional assembly sites for the selected SST25VF016B, SST25VF040B, SST25VF080B, SST25WF020A and SST26VF016 device families available in 8L TDFN-S (6x5x0.8mm) package.mpacts to Data Sheet:Yes.Note: Microchip will issue separate PCN for datasheet update.Reason for Change:To improve on-time delivery performance by qualifying UTL3 and NSEB as an additional assembly sites.Change Implementation Status:In ProgressEstimated First Ship Date:May 31, 2024 (date code: 2422)
Description of Change:Qualification of NSEB and UTL3 as additional assembly sites for the selected SST26VF016, SST25VF016B, SST25VF0x0B and SST25WF020Ax device families available in 8L TDFN-S (6x5x0.8mm) package.Pre and Post Change Summary: See attachedImpacts to Data Sheet:Yes.Note: Microchip will issue separate PCN for datasheet update.Change ImpactNoneReason for Change:To improve on-time delivery performance by qualifying UTL3 and NSEB as an additional assembly sites.Change Implementation Status:In ProgressEstimated Qualification Completion Date:January 2024Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Time Table Summary: See attached
Description of Change: Qualification of NSEB and UTL3 as additional assembly sites for selected SST25PF0xx, SST2xVF0xx, USBF1600x and USBF8100x device families available in 8L TDFN-S (6x5x0.8mm) package.Reason for Change: To improve on-time delivery performance by qualifying UTL3 and NSEB as an additional assembly sites.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=SST25VF040B-50-4I-QAF-T&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--memory--flash--norflash--serial/sst25vf040b-50-4i-qaf-t-microchip-6116594
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=SST25VF040B-50-4I-QAF-T&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--memory--flash--norflash--serial/sst25vf040b-50-4i-qaf-t-microchip-6116594
Microchip SST25VF040B-50-4I-QAF-T - Caractéristiques techniques
| Clock Frequency-Max: | 50MHz |
| Memory Density: | 4Mb |
| Memory Organization: | 512 K x 8 |
| Supply Voltage-Nom: | 2.7V to 3.6V |
| Temperature Grade: | Industrial |
| Style d'emballage : | WSON-8 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
2000 par Reel
Style d'emballage :
WSON-8
Méthode de montage :
Surface Mount