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Manufacturer Part #
SST26VF016-80-5I-QAE
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98 per Tube
WSON-8
Surface Mount
Shipping Information:
HTS Code:
ECCN:
PCN Information:
PCN Status:Final NotificationDescription of Change:Qualification of NSEB and UTL3 as additional assembly sites for the selected SST25VF016B, SST25VF040B, SST25VF080B, SST25WF020A and SST26VF016 device families available in 8L TDFN-S (6x5x0.8mm) package.mpacts to Data Sheet:Yes.Note: Microchip will issue separate PCN for datasheet update.Reason for Change:To improve on-time delivery performance by qualifying UTL3 and NSEB as an additional assembly sites.Change Implementation Status:In ProgressEstimated First Ship Date:May 31, 2024 (date code: 2422)
Description of Change:Qualification of NSEB and UTL3 as additional assembly sites for the selected SST26VF016, SST25VF016B, SST25VF0x0B and SST25WF020Ax device families available in 8L TDFN-S (6x5x0.8mm) package.Pre and Post Change Summary: See attachedImpacts to Data Sheet:Yes.Note: Microchip will issue separate PCN for datasheet update.Change ImpactNoneReason for Change:To improve on-time delivery performance by qualifying UTL3 and NSEB as an additional assembly sites.Change Implementation Status:In ProgressEstimated Qualification Completion Date:January 2024Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Time Table Summary: See attached
Revision History:July 28, 2022: Issued initial notification.October 7, 2022: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on October 8, 2022. Corrected typo in reason for change from ?assembly site? to ?final test site?.October 11, 2022. Corrected qualification report title from "Plan" to "Report".Description of Change:Qualification of MTAI as a new final test site for selected SST26VF016-80-5I-S2AE, SST26VF016-80-5I-QAE, SST26VF016-80-5I-S2AE-T andSST26VF016-80-5I-QAE-T catalog part numbers (CPN) available in 8L SOIJ (.208in) and 8L TDFN-S (6x5x0.8mm) packages.Reason for Change:To improve cycle time by qualifying MTAI as a new final test site.
Revision History:July 28, 2022: Issued initial notification.October 7, 2022: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on October 28, 2022. Corrected typo in reason for change from "assembly site" to "final test site".Description of Change:Qualification of MTAI as a new final test site for selected SST26VF016-80-5I-S2AE, SST26VF016-80-5I-QAE, SST26VF016-80-5I-S2AE-T and SST26VF016-80-5I-QAE-T catalog part numbers (CPN) available in 8L SOIJ (.208in) and 8L TDFN-S (6x5x0.8mm) packages.Reason for Change:To improve cycle time by qualifying MTAI as a new final test site.Estimated First Ship Date:October 28, 2022 (date code: 2244)
Part Status:
NOTE: This SST product is migrating to the preferred Microchip (MCP) part number. All products bearing the Microchip part number are identical in form, fit and function to the products with the legacy SST prefix/logo mark.
The SST26VF016-80-5I-QAE is a part of SST26VF series Flash Memory. It has an standard industria operating temperature ranging from -40°C to +85°C. It comes in WSON-8 package.
The SST26VF016 Serial Quad I/O (SQI) flash device utilizes a 4-bit multiplexed I/O serial interface to boost performance while maintaining the compact form factor of standard serial flash devices. Operating at frequencies reaching 80 MHz, the SST26VF016 / SST26VF032 enables minimum latency execute-in-place (XIP) capability without the need for code shadowing on an SRAM.
Features:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.