
Manufacturer Part #
PIC24FJ64GB004-I/ML
PIC24F Series 8 kB RAM 64 kB Flash 16-Bit Microcontroller SMT - QFN-44
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Mfr. Name: | Microchip | ||||||||||
Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:45 per Tube Package Style:QFN-44 Mounting Method:Surface Mount | ||||||||||
Date Code: | 1931 |
Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um TSMC wafer technology available in 28L QFN-S, 64L, 44L and 28L QFN packages.Pre Change: Assembled at MTAI assembly site using gold (Au) wire.Post Change: Assembled at MTAI assembly site using gold (Au) wire and MMT assembly site using palladium coated copper wire with gold flash (CuPdAu).Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site using palladium coated copper wire with gold flash (CuPdAu).Estimated First Ship Date:July 25, 2018(date code: 1830)
CCB 3028 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 0.25um TSMC wafer technology available in 44L QFN package at NSEB assemblyPre Change: Using gold (Au) bond wirePost Change: Using palladium coated copper with gold flash (CuPdAu) bond wire
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um TSMC, 70nm SMIC, Vanguard,120K,130K, 150K, 160K, 165K, 200K and 290K wafer technologies in 44L, 28 QFN-S, 20L,16L and 28L QFN packages.Pre Change:Assembled at MTAI assembly site.Post Change:Assembled at MTAI or MMT assembly site.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site Estimated First Ship Date:June 24, 2018 (date code:1826)
Revision History:July 18, 2017: Issued initial notification.April 27, 2018: Issued final notification. Attached the Qualification Report. Revised the affected parts list. Provided estimated first ship date on May 27, 2018.May 09, 2018: Re-issued final notification to correct the attached qual report.Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 0.25um TSMC wafer technology available in 44L QFN package at NSEB assembly site.Pre Change: Using gold (Au) bond wirePost Change: Using palladium coated copper with gold flash (CuPdAu) bond wire.Reason for Change:To improve manufacturability by qualifying CuPdAu bond wire at NSEB assembly site.Estimated First Ship Date:May 27, 2018 (date code: 1821)
CCB 3028 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu)bond wire in selected products of the 0.25um TSMC wafer technology available in 44L QFN package at NSEB assemblyPCN Status: Final notificationDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 0.25um TSMC wafer technology available in 44L QFN package at NSEB assembly site.Pre Change: Using gold (Au) bond wirePost Change: Using palladium coated copper with gold flash (CuPdAu) bond wireImpacts to Data Sheet: NoneChange Impact: NoneReason for Change: To improve manufacturability by qualifying CuPdAu bond wire at NSEB assembly site.Change Implementation Status: In ProgressEstimated First Ship Date: May 27, 2018 (date code: 1821) NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Method to Identify Change: Traceability codeQualification Plan: Please open the attachments included with this PCN labeled as PCN_#_Qual PlanRevision History:July 18, 2017: Issued initial notification.April 27, 2018: Issued final notification. Attached the Qualification Report. Revised the affected parts list. Provided estimated first ship date on May 27, 2018.The change described in this PCN does not alter Microchip�s current regulatory compliance regarding the material content of the applicable products.
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um TSMC, 70nm, SMIC, Vanguard,120K,130K, 150K, 160K, 165K, 200K and 290K wafer technologies available in 44L, 28L QFN-S, 20L,16L and 28L QFN packages..Pre Change: Assembled at MTAI assembly sitePost Change: Assembled at MTAI or MMT assembly siteReason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Estimated Qualification Completion Date:April 2018
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um TSMC, 70nm, SMIC, Vanguard,120K,130K, 150K, 160K, 165K, 200K and 290K wafer technologies available in 44L, 28L QFN-S, 20L,16L and 28L QFN packages.Pre Change: Assembled at MTAI assembly sitePost Change: Assembled at MTAI or MMT assembly siteReason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um TSMC wafer technology available in 64L,28L QFN-S, 44L and 28L packages.Pre Change: Assembled at MTAI assembly site using gold (Au) wire.Post Change: Assembled at MTAI assembly site using gold (Au) wire and MMT assembly site using palladium coated copper wire with gold flash (CuPdAu). Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site using palladium coated copper wire with gold flash (CuPdAu).Estimated Qualification Completion Date: April 2018
Product Lifecycle:
Technical Attributes
Family Name: | PIC24F |
Core Processor: | PIC |
Program Memory Type: | Flash |
Flash Size (Bytes): | 64kB |
RAM Size: | 8kB |
Speed: | 32MHz |
No of I/O Lines: | 35 |
InterfaceType / Connectivity: | I2C/SPI/UART/USB |
Peripherals: | Analog Comparators/I2C/On-Chip-ADC/PWM/SPI/UART/USB/Watchdog |
Number Of Timers: | 5 |
Supply Voltage: | 2V to 3.6V |
Operating Temperature: | -40°C to +85°C |
On-Chip ADC: | 13-chx10-bit |
Watchdog Timers: | 2 |
Package Style: | QFN-44 |
Mounting Method: | Surface Mount |
Features & Applications
PIC24FJ64GB004-I/ML is part of the PIC24F Series family with 64 kB Flash as a 16-Bit Microcontroller. It can sustain standard temperature ranges from -40°C to +85°C and has 33 i/o pins in a QFN package.
Features:
- CPU:
- Up to 16 MIPS performance.
- 16 x 16 Hardware Multiply, Single Cycle Execution.
- 32-bit x 16-bit Hardware Divider.
- C Compiler Optimized Instruction Set.
- System:
- Internal oscillator support - 31 kHz to 8 MHz, up to 32 MHz with 4X PLL.
- On-chip LDO Voltage Regulator.
- JTAG Boundary Scan and Flash Memory Program Support.
- Fail-Safe Clock Monitor – allows safe shutdown if clock fails.
- Watchdog Timer with separate RC oscillator.
- Analog Features:
- 10-bit ADC, 10 channels, 500 k samples per second.
- Two Analog comparators.
- Peripherals:
- 2 UART Modules with LIN and IrDA support, 4 Deep FIFO.
- 2 SPI Modules with 8 Deep FIFO.
- 2 I2C Modules with Master and Slave Modes.
- Five 16-bit Timer Modules.
- Up to 5 Input Capture and 5 Output Compare / PWM.
- Hardware RTCC, Real-Time Clock Calendar with Alarms.
- PMP, Parallel Master Port, with 8 Address Lines, and 8/16-bit Data.
- Universal Serial Bus Features:
- USB v2.0 On-the-Go compliant.
Available Packaging
Package Qty:
45 per Tube
Package Style:
QFN-44
Mounting Method:
Surface Mount