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Manufacturer Part #
PIC18F26K22-I/SO
PIC18F Series 64 kB Flash 3.8 KB RAM 64 MHz 8-Bit Microcontroller - SOIC-28
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:27 per Tube Package Style:SOIC-28 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2433 | ||||||||||
Microchip PIC18F26K22-I/SO - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=PIC18F26K22-I/SO&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--microcontrollers--8-bit/pic18f26k22-i-so-microchip-8007815
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=PIC18F26K22-I/SO&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--microcontrollers--8-bit/pic18f26k22-i-so-microchip-8007815
Microchip PIC18F26K22-I/SO - Technical Attributes
| Family Name: | PIC18 |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 64kB |
| RAM Size: | 3.8kB |
| Speed: | 64MHz |
| No of I/O Lines: | 25 |
| InterfaceType / Connectivity: | I2C/SPI/USART |
| Peripherals: | Analog Comparators/I2C/On-Chip-ADC/PWM/SPI/USART/Watchdog |
| Number Of Timers: | 7 |
| Supply Voltage: | 1.8V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 17-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | SOIC-28 |
| Mounting Method: | Surface Mount |
Features & Applications
The PIC18F26K22-I/SO is a low-power and high performance 8-bit Microcontroller with XLP Technology. Available in surface mount SOIC-28 package.
Features:
- High Performance RISC CPU:
- C Compiler optimized architecture/instruction set
- Data EEPROM to 1024 bytes
- Linear program memory addressing to 64 Kbytes
- Linear data memory addressing to 4 Kbytes
- Up to 16 MIPS operation
- 16-bit wide instructions, 8-bit wide data path
- Extreme Low-Power Management with nanoWatt XLP™:
- Sleep mode: 100 nA, typical
- Watchdog Timer: 500 nA, typical
- Timer1 Oscillator: 500 nA @ typical 32 kHz
- Flexible Oscillator Structure
- Precision 16 MHz internal oscillator block
- Four Crystal modes up to 64 MHz
- Two external Clock modes up to 64 MHz
- 4X Phase Lock Loop (PLL)
- Secondary oscillator using Timer1 @ 32 kHz
- Two-Speed Oscillator Start-up
- Special Microcontroller Features:
- Full 5.5V operation
- Low voltage option available for 1.8V-3.6V operation
- Self-reprogrammable under software control
- Power-on Reset (POR), Power-up Timer (PWRT) and Oscillator Start-up Timer (OST)
- Programmable Brown-out Reset (BOR)
- Analog Features:
- Analog-to-Digital Converter (ADC) module : 10-bit Resolution
- Programmable High/Low Voltage Detection (PLVD) module
- Charge Time Measurement Unit (CTMU) for mTouch™ support
- Analog comparator module
- Voltage reference module
- Peripheral Features:
- 24/35 I/O pins and 1 input-only pin
- Three external interrupt pins
- Up to seven Timer modules
- Up to two Capture/Compare/PWM (CCP) modules
- Up to three Enhanced Capture/Compare/PWM (ECCP) modules
- Two Master Synchronous Serial Port (MSSP) modules
- Two Enhanced Universal Synchronous Asynchronous Receiver Transmitter modules (EUSART)
Available Packaging
Package Qty:
27 per Tube
Package Style:
SOIC-28
Mounting Method:
Surface Mount
