Manufacturer Part #
PIC18LF14K50-I/SS
PIC18 Series 16 kB Flash 768 B RAM 48 MHz 8-Bit Microcontroller - SSOP-20
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:67 per Tube Package Style:SSOP-20 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2443 | ||||||||||
Microchip PIC18LF14K50-I/SS - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Part Status:
Microchip PIC18LF14K50-I/SS - Technical Attributes
| Family Name: | PIC18 |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 16kB |
| RAM Size: | 768B |
| Speed: | 48MHz |
| No of I/O Lines: | 15 |
| InterfaceType / Connectivity: | I2C/SPI/USART/USB |
| Peripherals: | Analog Comparators/I2C/On-Chip-ADC/PWM/SPI/USART/USB/Watchdog |
| Number Of Timers: | 4 |
| Supply Voltage: | 1.8V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 11-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | SSOP-20 |
| Mounting Method: | Surface Mount |
Features & Applications
The PIC18F14K50 brings advanced features and exceptional value to the embedded USB market. This low cost PIC® Microcontroller features a full speed USB 2.0 compliant interface that can automatically change clock sources and power levels upon connection to a host, making it an exceptional device for battery-powered applications. The addition of mTouch(TM) touch sensing compatibility, a 10-bit ADC, motor control PWMs, and a host of serial interfaces make the PIC18F14K50 the perfect device to "Just add USB" to any application.
Features:
- Universal Serial Bus Features:
- USB V2.0 Compliant SIE
- Full Speed (12 Mb/s) and Low Speed (1.5 Mb/s)
- Supports Control, Interrupt, Isochronous and Bulk Transfers
- Supports up to 16 Endpoints (8 bidirectional)
- High Performance RISC CPU:
- C Compiler Optimized Architecture:
- Optional extended instruction set designed to optimize re-entrant code
- 256 bytes, data EEPROM
- Up to 16 Kbytes linear program memory addressing
- Up to 768 bytes linear data memory addressing
- Priority levels for Interrupts
- 8 x 8 Single-Cycle Hardware Multiplier
- C Compiler Optimized Architecture:
- Flexible Oscillator Structure:
- CPU divider to run the core slower than the USB peripheral
- 16 MHz Internal Oscillator Block:
- Software selectable frequencies, 31 kHz to 16 MHz
- Provides a complete range of clock speeds from 31 kHz to 32 MHz when used with PLL
- User tunable to compensate for frequency drift
- Four Crystal modes, up to 48 MHz
- External Clock modes, up to 48 MHz
- Special Microcontroller Features:
- Full 5.5 V Operation – PIC18F1XK50
- 1.8 V-3.6 V Operation – PIC18LF1XK50
- Self-programmable under Software Control
- Programmable Brown-out Reset (BOR)
- With software enable option
- Extended Watchdog Timer (WDT)
- Programmable period from 4ms to 131s
- Single-supply 3 V In-Circuit Serial Programming™ (ICSP™) via two pins
- Extreme Low-Power Management with nanoWatt XLP:
- Sleep mode: 24 nA
- Watchdog Timer: 450 nA
- Timer1 Oscillator: 790 nA @ 32 kHz
- Analog Features:
- Analog-to-Digital Converter (ADC) module:
- 10-bit resolution, 9 external channels
- Auto acquisition capability
- Conversion available during Sleep
- Internal 1.024 V Fixed Voltage Reference (FVR) channel
- Independent input multiplexing
- Dual Analog Comparators
- Rail-to-rail operation
- Independent input multiplexing
- Analog-to-Digital Converter (ADC) module:
- Peripheral Features:
- 14 I/O Pins plus 1 Input-only pin:
- High-current sink/source 25 mA/25 mA
- 7 Programmable weak pull-ups
- 14 I/O Pins plus 1 Input-only pin:
Available Packaging
Package Qty:
67 per Tube
Package Style:
SSOP-20
Mounting Method:
Surface Mount