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Manufacturer Part #
R9A08G045S33GBG#BC0
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952 per Tray
Surface Mount
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Description of Change: In response to the recent increase in semiconductor demand and the resulting production capacity constraints, we will add an assembly manufacturing site in Japan. As part of this change, the package substrate will also be changed for the products: (RZ/V2L 21mmPKG, N2L 10mmPKG, G3S 14mmPKG) REASON:To enhance supply stability and improve manufacturing productivity for the RZ product family, an additional assembly manufacturing site will be introduced and parallel production will commence. In connection with the introduction of this new manufacturing site, the package substrate will also be changed. The additional assembly site will provide greater manufacturing flexibility and help ensure a stable and reliable supply of products to our customers. Qualification Completion Date: 08/31/2026 Sample Availability Date : 08/31/2026
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.