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Manufacturer Part #
MCP79400T-I/SN
MCP79400 Series 5.5 V 64 byte SMT I2C™ Real-Time Clock/Calendar - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3300 per Reel Package Style:SOIC-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP79400T-I/SN - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Microchip has released a new Datasheet for the MCP79400/01/02 - Battery-Backed I2C Real-Time Clock/Calendar with SRAM and Protected EEPROM of devices. If you are using one of these devices please read the document located at MCP79400/01/02 - Battery-Backed I2C Real-Time Clock/Calendar with SRAM and Protected EEPROM.Data Sheet - MCP79400/01/02 - Battery-Backed I2C Real-Time Clock/Calendar with SRAM and Protected EEPROMNotification Status: FinalDescription of Change: Replaced terminology ?Master? and ?Slave? with ?Host? and ?Client?, respectively; Corrected the MSOP pinout on ?Package Marking Information?.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 26 Oct 2023NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Data Sheet - MCP79400/01/02 Battery-Backed I2C RTCC w/ SRAM and Protected EEPROM Data Sheet Document RevisionDescription of Change: 1) Updated Section 6.3. 2) Updated Product Identification System.Reason for Change: To Improve ProductivityNOTE: Please be advised that this is a change to the document only the product has not been changed.
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP79400T-I/SN&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--real-time-clocks/mcp79400t-i-sn-microchip-7008158
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP79400T-I/SN&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--real-time-clocks/mcp79400t-i-sn-microchip-7008158
Microchip MCP79400T-I/SN - Technical Attributes
| Date Format: | DW:DM:M:Y |
| Time Format: | HH:MM:SS |
| Interface: | I2C |
| Non-Volatile Memory Size: | 64B |
| Supply Voltage-Nom: | 1.8V to 5.5V |
| Temperature Grade: | Industrial |
| Operating Temp Range: | -40°C to +85°C |
| Storage Temperature Range: | -65°C to +150°C |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Features & Applications
The clock/calender automatically adjusts for months with fewer than 31 days, including corrections for leap years and low-cost 32.768 kHz crystal is used to track the time.
Features:
- Real-Time Clock/Calendar (RTCC), Battery Backed:
- Hours, Minutes, Seconds, Day of Week, Day, Month and Year
- Dual alarm with single output
- On-Chip Digital Trimming/Calibration:
- Range -127 to +127 ppm
- Resolution 1 ppm
- Programmable Open-Drain Output Control:
- CLKOUT with 4 selectable frequencies
- Alarm output
- 64-Bit Unique ID:
- User or factory programmable
- Protected EEPROM
- EUI-48™ or EUI-64™ MAC address
- Custom ID programming
- Automatic VCC Switchover to VBAT Backup Supply
- Power-Fail Time-Stamp for Battery Switchover
- Low-Power CMOS Technology:
- Dynamic Current: 400 µA max read
- Dynamic Current: 400 µA max SRAM
- Battery Backup Current: <700nA @ 1.8V
- 100 kHz and 400 kHz Compatibility
- ESD Protection >4,000V
- 1 Million Erase/Write Cycles for Unique ID
- Packages include 8-Lead SOIC, TSSOP, 2x3 TDFN, MSOP
- Pb-Free and RoHS Compliant
- Temperature Ranges:
- Industrial (I): -40°C to +85°C
Available Packaging
Package Qty:
3300 per Reel
Package Style:
SOIC-8
Mounting Method:
Surface Mount