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Manufacturer Part #
MCP7940NT-E/MS
IC RTC CLK/CALENDAR I2C 8-MSOP
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:2500 per Reel | ||||||||||
| Date Code: | |||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: 1) Added notes regarding automotive grade availability. 2) Corrected MSOP marking rotation. 3) Updated package drawings SOIC and PDIP.Reason for Change: To Improve ProductivityDate Document Changes Effective: 31 Oct 2019NOTE: Please be advised that this is a change to the document only the product has not been changed.
Data Sheet - MCP7940N Battery-Backed I2C RTCC with SRAMMicrochip has released a new DeviceDoc for the MCP7940N Battery-Backed I2C RTCC with SRAM of devices.Notification Status:FinalDescription of Change: Updated Section 5.5.1 “Square Wave Output Mode”.Impacts to Data Sheet: NoneReason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 20 Aug 2018NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Revision History:November 28, 2017: Issued initial notification.December 22, 2017: Re-issued initial notification to correct the Pre and Post Change summary from CuPdAu wire to Au wire.May 23, 2018: Issued final notification. Attached the Qualification Report. Revised the affected parts list. Provided estimated first ship date on June 23, 2018.July 09, 2018: Resend PCN to update qual report title.Description of Change:Qualification of MMT as an additional assembly site for selected products available in 8L MSOP package using gold (Au) bond wire.Pre Change: Assembled at MTAI assembly site.Post Change: Assembled at MTAI or MMT assembly site.Reason for Change:To improve productivity by qualifying MMT as an additional assembly site.Estimated First Ship Date: June 23, 2018 (date code: 1825)
Revision History:April 23, 2018: Issued initial notification.June 27, 2018: Issued final notification. Attached the Qualification Report and provided estimated first ship date to be on July 27, 2018.July 09, 2018: Re-issued final notification to correct the attached Qualification report.Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 160K wafer technology available in 8L MSOP package at MTAI assembly site.Pre Change: Using gold (Au) bond wire.Post Change: Using palladium coated copper with gold flash(CuPdAu) bond wire.Reason for Change:To improve on-time delivery performance by qualifying palladium coated copper with gold flash(CuPdAu) bond wire.Estimated First Ship Date:July 27, 2018 (date code: 1830)
CCB 3230 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 160K wafer technology available in 8L MSOP package at MTAI assembly site. PCN Status: Final notification. PCN Type: Manufacturing ChangeDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 160K wafer technology available in 8L MSOP package at MTAI assembly site. Pre Change: Using gold (Au) bond wirePost Change: Using palladium coated copper with gold flash(CuPdAu) bond wire.
Part Status:
Available Packaging
Package Qty:
2500 per Reel