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Manufacturer Part #
UCS2113-1-V/G4
UCS2113 Series 5.5 V 3 A USB Dual-Port Power Switch and Current Monitor - QFN-20
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:91 per Tube Package Style:QFN-20 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip UCS2113-1-V/G4 - Product Specification
Shipping Information:
ECCN:
PCN Information:
Microchip has released a new Product Documents for the UCS2113 USB Dual-Port Power Switch and Current Monitor Data Sheet of devices.Notification Status: FinalDescription of Change: Revision includes: 1. Added automotive qualification to Features. 2. Updated document layout. 3. Updated markings and drawings in Section 9.0 “Packaging Information”. 4. Updated Product Identification System to include automotive information and examples.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 07 December 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Revision History:January 27, 2020: Issued initial notification.February 24, 2020: Issued final notification. Attached the qualification report. Updated the affected CPN list.Description of Change:Qualification of MTAI as a new assembly site for UCS2112 and UCS2113 device families available in 20L QFN (4x4mm) package.Pre Change:Assembled at ASE assembly site using EN-4900 die attach material and G631H mold compound material.Post Change:Assembled at MTAI assembly site using 8008MD die attach material and G700LTD mold compound material.Reason for Change:To improve on-time delivery performance by qualifying MTAI assembly site using 8008MD die attach material and G700LTD mold compound material.Estimated First Ship Date:March 30, 2020 (date code: 2014)
Notification subject: CCB 3472 Initial Notice: Qualification of MTAI as a new assembly site for UCS2112 and UCS2113 device families available in 20L QFN (4x4mm) packagePCN Status: Initial notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of MTAI as a new assembly site for UCS2112 and UCS2113 device families available in 20L QFN (4x4mm) package.Pre Change: Assembled at ASE assembly site using EN-4900 die attach material and G631H mold compound material.Post Change: Assembled at MTAI assembly site using 8008MD die attach material and G700LTD mold compound material.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change: To improve on-time delivery performance by qualifying MTAI assembly site using 8008MD die attach material and G700LTD mold compound material.Change Implementation Status: In ProgressEstimated Qualification Completion Date: February 2020
Part Status:
Microchip UCS2113-1-V/G4 - Technical Attributes
| Package Style: | QFN-20 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
91 per Tube
Package Style:
QFN-20
Mounting Method:
Surface Mount