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Infineon — AIROC™ CYW5551x Series Wi-Fi 6/6E and Bluetooth® 6.0 Solution

Infineon

 

Infineon AIROC™ CYW5551x Series Wi-Fi 6/6E and Bluetooth® 6.0 Solution

High performance wireless connectivity on a single chip

Infineon’s AIROC™ CYW5551x series brings the advanced features of Wi-Fi® 6 and Bluetooth® Low Energy 6.0 together in a single-chip solution, available in easy-to-integrate modules from Murata and Ezurio.

The AIROC CYW5551x chipsets are designed for reliable, high-performance wireless communication in space- and power-constrained applications such as IoT devices, smart home products, and wearables. These chips exceed the Wi-Fi 6/6E standard, enabling faster data transfers and improved performance in congested network environments.

The series includes three variants:

  • CYW55513 (tri-band 2.4 GHz / 5 GHz / 6 GHz)
  • CYW55512 (dual-band)
  • CYW55511 (single-band)

Each integrates an IEEE 802.11ax-compliant Wi-Fi 6/6E transceiver and Bluetooth/Bluetooth Low Energy (LE) v5.4 subsystem. A 192 MHz Arm® Cortex®-M33 processor handles Bluetooth system control and supports both hosted/controller and embedded Bluetooth operating modes.

Two module options are available:

  • Murata Type 2FY (LBEE5HY2FY-922): ultra-compact for power- and space-sensitive industrial applications (up to 85°C)
  • Ezurio Sona™ IF513 (453-00195): industrial-grade module with SDIO/UART interfaces, offered in pluggable card and SMT M.2 formats

Features

Wi-Fi / LAN

  • High transmit power: +24 dBm
  • Best-in-class sensitivity: -101.5 dBm
  • Wi-Fi 6/6E enhancements: HE ER-PPDU, long guard intervals, long OFDM symbol, DCM
  • Access to 6 GHz greenfield spectrum for lower latency and extended range
  • 11ax Target Wake Time (TWT) for power saving
  • WPA2/WPA3 Personal/Enterprise security
  • Internal or external LNA/PA support and antenna diversity

Interfaces

  • WLAN: SDIO 3.0, shared SDIO, GSPI
  • Bluetooth: HSUART, shared SDIO
  • Audio: 2x TDM (I2S/PCM), DMI

 

Bluetooth®

  • Bluetooth® 6.0 (Classic + LE)
  • Embedded or hosted AIROC™ Bluetooth stack
  • Embedded LE Audio with LC3 codec via isochronous channels
  • Support for LE 2M, LE 1M, LE LR, and advertising extensions
  • Multiple power output paths: +4 dBm, +13 dBm, +19 dBm
  • Optimized coexistence with Wi-Fi, 802.15.4/Thread, and LTE (shared or dedicated antenna)

Coexistence & Packaging

  • Advanced coexistence: 2-wire BTSIG WCI-2 (LTE), 3-wire (ZigBee)
  • Package: WLBGA

Benefits

  • Optimized for IoT applications
  • Access to greenfield 6GHz band for increased channel availability
  • Enhances network efficiency and range
  • Power-saving features
  • Embedded or hosted Bluetooth LE Audio support
  • Built-in multi-layer security for added protection

Applications

  • Smart home devices
  • IoT and Industrial IoT (IIoT)
  • IP cameras and video doorbells
  • Smart door locks
  • Household appliances
  • Smartwatches and smart glasses
  • Environmental and motion sensors
  • Smart speakers
  • Smart lighting systems

 

Development Kits

  • Ezurio 453-00195-K1 Development Kit (based on the Sona™ IF513 module)
  • Embedded Artists EAR00511 M.2 Module Eval Kit (based on the Murata Type 2FY module)

 

Infineon AIROC™ CYW5551x Series Diagram

 


Infineon AIROC™ CYW5551x Series

 

Meet the AIROC™ CYW5551x Combo Family