text.skipToContent text.skipToNavigation
  1.  
  2. Resources
  3. New Featured Products
  4. Panasonic — PAN1326C2 Series Bluetooth® Multi Mode Wireless Connectivity RF Module and Evaluation Kit

Panasonic — PAN1326C2 Series Bluetooth® Multi Mode Wireless Connectivity RF Module and Evaluation Kit

 
Panasonic

 

The new PAN1326C2 Evaluation Kit is a versatile, all-inclusive Evaluation Kit consisting of one Daughterboard (ETU) for TI’s Development Board and one TI Adapter Board.

The New Bluetooth 4.2 compliant PAN1326C2 offers best-in-class RF performance. Panasonic’s tiny footprint technology has produced a Module of only 85.5mm² for easy use in space constrained applications. The PAN1326C2 is designed to accommodate a PCB pad pitch of 1.3mm and as little as two layers for easy implementation and manufacturing. This Module is designed for 100% pin compatibility with previous generations of Texas Instruments based Bluetooth HCI Modules.

Features & Benefits
  • Bluetooth 4.2 Compliant Up To The HCI Layer
  • Best-In-Class Bluetooth RF Performance (Tx, Rx Sensitivity, Blocking)
  • Fully Qualified Bluetooth
  • FCC And IC Listed, CE Compliant
  • Dimensions: 9.0 Mm x 9.5 Mm x 1.8 Mm (Width x Length x Height)
  • Operating Temperature Range: -40°C To +85°C
  • Supply Voltage Range: 1.7 - 4.8 V
  • Based Upon TI’s CC2564C
  • RoHS and REACH Compliant
Applications
  • Heart Rate Monitors
  • Blood Glucose Meters
  • Industrial Sensors
  • Entertainment Devices
  • Mobile Accessories
  • Toys
Related Documents