The new PAN1326C2 Evaluation Kit is a versatile, all-inclusive Evaluation Kit consisting of one Daughterboard (ETU) for TI’s Development Board and one TI Adapter Board.
The New Bluetooth 4.2 compliant PAN1326C2 offers best-in-class RF performance. Panasonic’s tiny footprint technology has produced a Module of only 85.5mm² for easy use in space constrained applications. The PAN1326C2 is designed to accommodate a PCB pad pitch of 1.3mm and as little as two layers for easy implementation and manufacturing. This Module is designed for 100% pin compatibility with previous generations of Texas Instruments based Bluetooth HCI Modules.
Features & Benefits
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